Editor in Chief

• Dana, Leo Paul, Montpellier Business School, France
  (lp762359dal.ca)

Associate Editors

• Brahmi, Mohsen, IAE Southern Campus and FEM. S. University, Tunisia
• Ramadani, Veland, South-East European University, Macedonia, F.Y.R.
• Ratten, Vanessa, La Trobe University, Australia
• Vang, Jan, Aalborg University, Denmark

European Editor

• Rouach, Daniel, ESCP Europe, Germany

Editorial Board Members

• Acheampong, George, University of Ghana, Ghana
• Aldieri, Luigi, University of Salerno, Italy
• Andrade, Herlandí de Souza, University of Sao Paulo, Brazil
• Audretsch, David B., Indiana University, USA
• Bidault, Francis, Theseus International Management Institute, France
• Birley, Sue, Imperial College, UK
• Broccardo, Laura, University of Turin, Italy
• Chhabra, Meghna, Manav Rachna International Institute of Research and Studies, India
• Crupi, Antonio, Scuola Superiore Sant’Anna, Pisa, Italy
• Culasso, Francesca, University of Turin, Italy
• Del Sarto, Nicola, Scuola Superiore Sant'Anna, Italy
• Eisenhardt, Kathy, Stanford University, USA
• Eyerer, Peter, Fraunhofer Institut für Chemische Technologie (ICT), Germany
• Farber, David J., Carnegie Mellon University, USA
• Geisler, Eliezer, Illinois Institute of Technology, USA
• Georghiou, Luke, University of Manchester, UK
• Giacosa, Elisa, University of Turin, Italy
• Howells, Jeremy, University of Southampton, UK
• Jain, P.K., Indian Institute of Technology, India
• Jain, Ravi, University of the Pacific, USA
• Joshi, Manoj, Amity University, India
• Khoa, Bui Thanh, Industrial University of Ho Chi Minh City, Vietnam
• Kierkegaard, Sylvia Mercado, International Association of IT Lawyers, Denmark
• Kovac, Ivana, University of Zagreb, Croatia
• Krattiger, Anatole F., Cornell University, USA
• Krishna, Vinita, Shiv Nadar University, India
• Kumar, Vimal, Ministry of Science and Technology, India
• Liang, Dan, UNIDO Investment and Technology Promotion, Austria
• Mazzoleni, Alberto, University of Brescia, Italy
• Munroe, Tapan, Munroe Consulting, Inc, USA
• Musits, Bela L., Clarkson University, USA
• Mytelka, Lynn K., France
• Novak, Ivan, University of Zagreb, Croatia
• Obhodjas, Ibrahim, University Vitez Travnik, Bosnia and Herzegovina
• Ohkita, Kenichi, Aichi University, Japan
• Omrane, Amina, University of Sfax and IHEC Carthage, Tunisia
• Peris Ortiz, Marta, Universidad Politècnica de Valencia, Spain
• Premus, Robert, Wright-State University Rike Hall, USA
• Prencipe, Antonio, University of Teramo, Italy
• Rexhepi, Gadaf, South East European University, Macedonia, F.Y.R.
• Singh, Jagdeep, Ludhiana College of Engineering and Technology, India
• Tikas, Gaurav, Toyohashi University of Technology, Japan
• Troise, Ciro, Università degli Studi della Campania "Luigi Vanvitelli", Italy
• Van Maanen, John, Massachusetts Institute of Technology, USA
• Vernon, John M., Duke University, USA
• Vlacic, Ernest, Novamina, Croatia

A few essentials for publishing in this journal

• Submitted articles should not have been previously published or be currently under consideration for publication elsewhere.
• Conference papers may only be submitted if the paper has been completely re-written (more details available here) and the author has cleared any necessary permissions with the copyright owner if it has been previously copyrighted.
• Briefs, research notes and case studies are not published in this journal.
• All articles must be written in English, using UK spelling and terminology. If English is not your first language, please ask an English-speaking colleague to proofread your article.
• All our articles go through a double-blind review process.
• All authors must declare they have read and agreed to the content of the submitted article. A full statement of our Ethical Guidelines for Authors (PDF) is available.
• There are no charges for publishing with Inderscience, unless you require your article to be Open Access (OA). You can find moreinformation on OA here.



Submission process

• All articles for this journal must be submitted using our online submissions system.
• View Author guidelines.
• Submit here.