Editor in Chief

• Yang, Xiaobo, Oshkosh Corporation, USA
  (ijvpeditorgmail.com)

Associate Editors

• Gray, Jeremy P., General Motors, USA
• He, Yuping, University of Ontario Institute of Technology, Canada
• Shangguan, Wen-Bin, South China University of Technology, China
• Zhang, Nong, University of Technology, Sydney, Australia

Advisory Board

• Gillespie, Thomas D., Mechanical Simulation Corporation, USA
• Wong, Joe, Carleton University, Canada

Editorial Board Members

• Alsaleh, Mustafa, Caterpillar Inc., USA
• Ayalew, Beshah, Clemson University, USA
• Balling, Ole, Aarhus University, Denmark
• Barton, David, University of Leeds, UK
• Beji, Lotfi, University of Evry, France
• Cao, Dongpu, Cranfield University, UK
• Cheli, Federico, Politecnico di Milano, Italy
• Choi, Seung-Bok, Inha University, South Korea
• Cole, David, University of Cambridge, UK
• Gipser, Michael, Esslingen University of Applied Sciences, Germany
• Gobbi, Massimiliano, Politecnico di Milano (Technical University), Italy
• Guan, Hsin, Jilin University, China
• Hofman, Theo, Technische Universiteit Eindhoven, Netherlands
• Jayakumar, Paramsothy, US Army RDECOM TARDEC, USA
• Kang, Ken, Honda R & D Americas, Inc, USA
• Lu, Jianbo, Ford Motor Company, USA
• Nishihara, Osamu, Kyoto University, Japan
• Peng, Yiqiang, Xihua University, China
• Rakheja, Subhash, Concordia University, Canada
• Shabana, Ahmed A., University of Illinois at Chicago, USA
• Sugiyama, Hiroyuki, University of Iowa, USA
• Sujatha, C., Indian Istitute of Technology, Madras, India
• Tasora, Alessandro, Università degli Studi di Parma, Italy
• Tjhung, Tana, Fiat Chrysler Automobiles, USA
• Wasfy, Tamer, Purdue School of Engineering and Technology at IUPUI, USA
• Wu, Guangqiang, Tongji University, China
• Xu, Peijun, Ebco Inc, USA
• Zhang, Xiong, General Dynamics Land Systems – Canada, Canada
• Zhao, Tianshou, Hong Kong University of Science and Technology, Hong Kong SAR, China

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• Submit here.