Editor in Chief

• Yang, Xiaobo, Oshkosh Corporation, USA
  (ijvpeditorgmail.com)

Associate Editors

• He, Yuping, University of Ontario Institute of Technology, Canada
• Pappalardo, Carmine Maria, University of Salerno, Italy
• Shangguan, Wen-Bin, South China University of Technology, China
• Zhang, Nong, Hefei University of Technology, China

Advisory Board

• Gillespie, Thomas D., Mechanical Simulation Corporation, USA
• Wong, Joe, Carleton University, Canada

Editorial Board Members

• Akalin, Ozgen, Istanbul Technical University, Turkey
• Alsaleh, Mustafa, Caterpillar Inc., USA
• Ayalew, Beshah, Clemson University, USA
• Balling, Ole, Aarhus University, Denmark
• Barton, David, University of Leeds, UK
• Beji, Lotfi, Université d'Évry-Val-d'Essonne, France
• Cao, Dongpu, Cranfield University, UK
• Cheli, Federico, Politecnico di Milano, Italy
• Choi, Seung-Bok, Inha University, South Korea
• Cole, David, University of Cambridge, UK
• Gipser, Michael, Esslingen University of Applied Sciences, Germany
• Gobbi, Massimiliano, Politecnico di Milano (Technical University), Italy
• Guan, Hsin, Jilin University, China
• Hofman, Theo, Technische Universiteit Eindhoven, Netherlands
• Huang, Wei, National Research Council of Canada, Canada
• Hughes, Ian, Innervycs, Chile
• Jayakumar, Paramsothy, US Army RDECOM TARDEC, USA
• Kang, Ken, Honda R & D Americas, Inc, USA
• Kluge, Torsten, dSPACE GmbH, Germany
• Lu, Jianbo, Ford Motor Company, USA
• Nishihara, Osamu, Kyoto University, Japan
• Peng, Yiqiang, Xihua University, China
• Rakheja, Subhash, Concordia University, Canada
• Reinecke, John, Council for Scientific and Industrial Research, South Africa
• Rybansky, Marian, University of Defence in Brno, Czech Republic
• Shabana, Ahmed A., University of Illinois at Chicago, USA
• Sugiyama, Hiroyuki, University of Iowa, USA
• Sujatha, C., Indian Istitute of Technology, Madras, India
• Tang, Xiaolin, Chongqing University, China
• Tasora, Alessandro, Università degli Studi di Parma, Italy
• Tjhung, Tana, Stellantis, USA
• Wasfy, Tamer, Purdue School of Engineering and Technology at IUPUI, USA
• Wu, Guangqiang, Tongji University, China
• Xu, Peijun, Ebco Inc, USA
• Zhang, Xiong, General Dynamics Land Systems – Canada, Canada
• Zhao, Tianshou, Hong Kong University of Science and Technology, Hong Kong SAR, China

A few essentials for publishing in this journal

• Submitted articles should not have been previously published or be currently under consideration for publication elsewhere.
• Conference papers may only be submitted if the paper has been completely re-written (more details available here) and the author has cleared any necessary permissions with the copyright owner if it has been previously copyrighted.
• Briefs and research notes are not published in this journal.
• All our articles go through a double-blind review process.
• All authors must declare they have read and agreed to the content of the submitted article. A full statement of our Ethical Guidelines for Authors (PDF) is available.
• There are no charges for publishing with Inderscience, unless you require your article to be Open Access (OA). You can find more information on OA here.



Submission process

• All articles for this journal must be submitted using our online submissions system.
• View Author guidelines.
• Submit here.