Editor in Chief

• Dorgham, M.A., International Centre for Technology and Management, UK
  (editorialinderscience.com)

Associate Editor

• Eyerer, Peter, Fraunhofer Institut für Chemische Technologie (ICT), Germany

Japanese Editor

• Kobayashi, Toshiro, Toyohashi University of Technology, Japan

Editorial Board Members

• Astrorn, Thomas, Royal Institute of Technology, Sweden
• Beardmore, Peter, Ford Motor Co, USA
• Besterci, Michal, Slovak Academy of Sciences, Slovakia
• Castro, P., Universidade Federal Fluminense, Brazil
• Champagne, Blaise, Industrial Materials Research Institute, Canada
• Evans, A.G., University of California, Santa Barbara, USA
• Gabbert, U., Otto-von-Guericke-Universität Magdeburg, Germany
• Gillespie, Jr., John W., University of Delaware, USA
• Grum, Janez, University of Ljubljana, Slovenia
• Inoue, Akihisa, University of Tohoku, Japan
• Kagawa, Yutaka, The University of Tokyo, Japan
• Kageyama, Kazuro, University of Tokyo, Japan
• Kedward, K.T., University of California-Santa Barbara, USA
• Lin, Jianguo, Imperial College, UK
• Nagai, Kotobu, National Institute for Material Science, Japan
• Nefedov, OIeg M, National Committee of Russian Chemists, Russian Federation
• Noori, Mohammad, California Polytechnic State University, USA
• Ochiai, Shojiro, Kyoto University, Japan
• Ping, Yang, Jiangsu University, China
• Plumtree, A., University of Waterloo, Canada
• Rudnev, Valery, INDUCTOHEAT, USA
• Springer, George S., Stanford University, USA
• Starke, Jr, Edgar A., University of Virginia, USA
• Subbarao, E.C., Tata Research Development and Design Centre, India
• Talreja, Ramesh, Texas A&M University, USA
• Totten, George E., G.E. Totten & Associates, Inc., and Portland State University, USA
• Vilar, Rui, Instituto Superior Técnico, Portugal
• Voggenreiter, Heinz, EADS, France
• Wagner, Lothar, Brandenburgische Technische Universität Cottbus, Germany
• Wang, Fuhui, State Key Laboratory for Corrosion and Protection Institute of Metal Research, China
• Williams, J.C., GE Engineering Materials Technology Labs, USA
• Wu, Zhishen, Southeast University, China
• Yonezu, Hiroo, Toyohashi University of Technology, Japan

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