Login Help Sitemap
Inderscience Publishers - linking academia, business and industry through research
  • Home
  • For Authors
  • For Librarians
  • Orders
  • Inderscience Online
  • News
  1. International Journal of Materials and Product Technology
  2. Published issues
  3. 2021 Vol.63 No.4
International Journal of Materials and Product Technology (IJMPT)

International Journal of Materials and Product Technology

2021 Vol.63 No.4


Pages Title and author(s)
247-261Experimental and finite element analyses for residual stress prediction of welded SAE-1018 steel joints
Mukhul Venkatesh Babu; Ajith Ramesh; Saravanamurugan Sundaram
DOI: 10.1504/IJMPT.2021.10040317
262-290Influence of superimposition of high frequency current to CC-GTAW and PC-GTAW welding producing superior characteristics of weld joints of SDSS
Rajeev Kumar; Somnath Chattopadhyaya; B.P. Agarwal; Sanjeev Kumar; K. Devakumaran
DOI: 10.1504/IJMPT.2021.10040999
291-304RF sputtered hexagonal boron nitride film-based printed circuit board for high voltage and high-power electronic applications
K.R. Remesh Kumar; K. Shreekrishna Kumar
DOI: 10.1504/IJMPT.2021.10041991
305-320Statistical and experimental evaluation of multi-performance in turning of AISI D6 using Grey relational analysis
Latif Ozler; Gul Tosun; Nihat Parlak; Nihat Tosun
DOI: 10.1504/IJMPT.2021.10041992
321-338Multi-objective optimisation for indentation rate, nugget diameter and tensile load in resistance spot welding using Taguchi-based grey relational analysis
Celalettin Yuce
DOI: 10.1504/IJMPT.2021.10040035

 

  • Sign up for new issue alerts
  • Subscribe/buy articles/issues
  • View sample articles
  • Latest issue contents as RSS feed
  • Forthcoming articles
  • Journal information in easy print format (PDF)
  • Publishing with Inderscience: ethical statement
  • Recommend to a librarian (PDF)
  • Feedback to Editor
  • Get permission to reproduce content
  • Find related journals
Keep up-to-date
  • BlogOur Blog
  • TwitterFollow us on Twitter
  • FacebookVisit us on Facebook
  • Our Newsletter (subscribe for free)
  • RSS Feeds
  • New issue alerts
Return to top
  • Contact us
  • About Inderscience
  • OAI Repository
  • Privacy and Cookies Statement
  • Terms and Conditions
  • Help
  • Sitemap
  • © Inderscience Enterprises Ltd.