
International Journal of Materials and Product Technology
2009 Vol.34 No.1/2
Special Issue on Micro/Nanoelectronics and NEMS and MEMS Packaging
Guest Editors: Dr. Cemal Basaran and Dr. Hua Ye
Pages | Title and author(s) |
3-36 | Computational implementation of Cosserat continuumJuan Gomez, Cemal Basaran DOI: 10.1504/IJMPT.2009.022401 |
37-53 | Character of the magnetic monopole fieldAli Reza Hadjesfandiari DOI: 10.1504/IJMPT.2009.022402 |
54-65 | Thermo-mechanical behaviour of a micromirror for
laser-to-fibre active alignment using bimorphs with breakable tethersHajime Kitagawa, David J. Boteler, Y.C. Lee DOI: 10.1504/IJMPT.2009.022403 |
66-76 | Liquid crystal polymer for RF MEMS packagingFaheem F. Faheem, Y.C. Lee DOI: 10.1504/IJMPT.2009.022404 |
77-94 | The integration of nanowires and nanotubes with microstructuresOngi Englander, Dane Christensen, Liwei Lin DOI: 10.1504/IJMPT.2009.022405 |
95-110 | Sintered nanosilver paste for high-temperature power semiconductor device attachmentJesus N. Calata, Thomas G. Lei, Guo-Quan Lu DOI: 10.1504/IJMPT.2009.022406 |
111-130 | An investigation of combined size, rate and thermal effects on the material properties of single crystal diamondLuming Shen, Zhen Chen DOI: 10.1504/IJMPT.2009.022407 |
131-138 | Use of stress-engineered material layers for the measurement of interfacial fracture toughness of nanoscale thin filmsJiantao Zheng, Suresh K. Sitaraman DOI: 10.1504/IJMPT.2009.022408 |
139-157 | A robust digital image correlation technique for high-resolution characterisation of microelectronic packaging materialsVenkatakrishnan Srinivasan, Satish Radhakrishnan, Thanate Ratanawilai, Ganesh Subbarayan, Terry V. Baughn, Luu T. Nguyen DOI: 10.1504/IJMPT.2009.022409 |
158-171 | Heat transfer with nanofluids for electronic coolingV. Vasu, K Rama Krishna, A.C.S. Kumar DOI: 10.1504/IJMPT.2009.022410 |
172-187 | On the thermodynamics of higher-order gradient plasticity for size-effects at the micron and submicron length scalesRashid K. Abu Al-Rub, Geroge Z. Voyiadjis, Elias C. Aifantis DOI: 10.1504/IJMPT.2009.022411 |
188-199 | Development of cryogenic power modules for superconducting hybrid power electronic systemHua Ye, Changwoo Lee, Randy W. Simon, Pradeep Haldar DOI: 10.1504/IJMPT.2009.022412 |
200-213 | A study of mechanical and thermal properties of materials in electronic packaging: application of micro DICDongsheng Zhang, Chenglin Lu, Peng Lu, Dwayne Arola DOI: 10.1504/IJMPT.2009.022413 |