International Journal of Materials and Product Technology (IJMPT)

International Journal of Materials and Product Technology

2009 Vol.34 No.1/2

Special Issue on Micro/Nanoelectronics and NEMS and MEMS Packaging

Guest Editors: Dr. Cemal Basaran and Dr. Hua Ye

Foreword

Pages Title and author(s)
3-36Computational implementation of Cosserat continuum
Juan Gomez, Cemal Basaran
DOI: 10.1504/IJMPT.2009.022401
37-53Character of the magnetic monopole field
Ali Reza Hadjesfandiari
DOI: 10.1504/IJMPT.2009.022402
54-65Thermo-mechanical behaviour of a micromirror for laser-to-fibre active alignment using bimorphs with breakable tethers
Hajime Kitagawa, David J. Boteler, Y.C. Lee
DOI: 10.1504/IJMPT.2009.022403
66-76Liquid crystal polymer for RF MEMS packaging
Faheem F. Faheem, Y.C. Lee
DOI: 10.1504/IJMPT.2009.022404
77-94The integration of nanowires and nanotubes with microstructures
Ongi Englander, Dane Christensen, Liwei Lin
DOI: 10.1504/IJMPT.2009.022405
95-110Sintered nanosilver paste for high-temperature power semiconductor device attachment
Jesus N. Calata, Thomas G. Lei, Guo-Quan Lu
DOI: 10.1504/IJMPT.2009.022406
111-130An investigation of combined size, rate and thermal effects on the material properties of single crystal diamond
Luming Shen, Zhen Chen
DOI: 10.1504/IJMPT.2009.022407
131-138Use of stress-engineered material layers for the measurement of interfacial fracture toughness of nanoscale thin films
Jiantao Zheng, Suresh K. Sitaraman
DOI: 10.1504/IJMPT.2009.022408
139-157A robust digital image correlation technique for high-resolution characterisation of microelectronic packaging materials
Venkatakrishnan Srinivasan, Satish Radhakrishnan, Thanate Ratanawilai, Ganesh Subbarayan, Terry V. Baughn, Luu T. Nguyen
DOI: 10.1504/IJMPT.2009.022409
158-171Heat transfer with nanofluids for electronic cooling
V. Vasu, K Rama Krishna, A.C.S. Kumar
DOI: 10.1504/IJMPT.2009.022410
172-187On the thermodynamics of higher-order gradient plasticity for size-effects at the micron and submicron length scales
Rashid K. Abu Al-Rub, Geroge Z. Voyiadjis, Elias C. Aifantis
DOI: 10.1504/IJMPT.2009.022411
188-199Development of cryogenic power modules for superconducting hybrid power electronic system
Hua Ye, Changwoo Lee, Randy W. Simon, Pradeep Haldar
DOI: 10.1504/IJMPT.2009.022412
200-213A study of mechanical and thermal properties of materials in electronic packaging: application of micro DIC
Dongsheng Zhang, Chenglin Lu, Peng Lu, Dwayne Arola
DOI: 10.1504/IJMPT.2009.022413

 

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