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International Journal of Materials and Product Technology (IJMPT)

International Journal of Materials and Product Technology

2009 Vol.34 No.1/2

Special Issue on Micro/Nanoelectronics and NEMS and MEMS Packaging

Guest Editors: Dr. Cemal Basaran and Dr. Hua Ye

Pages	Title and author(s)
3-36	Computational implementation of Cosserat continuum Juan Gomez, Cemal Basaran DOI: 10.1504/IJMPT.2009.022401
37-53	Character of the magnetic monopole field Ali Reza Hadjesfandiari DOI: 10.1504/IJMPT.2009.022402
54-65	Thermo-mechanical behaviour of a micromirror for laser-to-fibre active alignment using bimorphs with breakable tethers Hajime Kitagawa, David J. Boteler, Y.C. Lee DOI: 10.1504/IJMPT.2009.022403
66-76	Liquid crystal polymer for RF MEMS packaging Faheem F. Faheem, Y.C. Lee DOI: 10.1504/IJMPT.2009.022404
77-94	The integration of nanowires and nanotubes with microstructures Ongi Englander, Dane Christensen, Liwei Lin DOI: 10.1504/IJMPT.2009.022405
95-110	Sintered nanosilver paste for high-temperature power semiconductor device attachment Jesus N. Calata, Thomas G. Lei, Guo-Quan Lu DOI: 10.1504/IJMPT.2009.022406
111-130	An investigation of combined size, rate and thermal effects on the material properties of single crystal diamond Luming Shen, Zhen Chen DOI: 10.1504/IJMPT.2009.022407
131-138	Use of stress-engineered material layers for the measurement of interfacial fracture toughness of nanoscale thin films Jiantao Zheng, Suresh K. Sitaraman DOI: 10.1504/IJMPT.2009.022408
139-157	A robust digital image correlation technique for high-resolution characterisation of microelectronic packaging materials Venkatakrishnan Srinivasan, Satish Radhakrishnan, Thanate Ratanawilai, Ganesh Subbarayan, Terry V. Baughn, Luu T. Nguyen DOI: 10.1504/IJMPT.2009.022409
158-171	Heat transfer with nanofluids for electronic cooling V. Vasu, K Rama Krishna, A.C.S. Kumar DOI: 10.1504/IJMPT.2009.022410
172-187	On the thermodynamics of higher-order gradient plasticity for size-effects at the micron and submicron length scales Rashid K. Abu Al-Rub, Geroge Z. Voyiadjis, Elias C. Aifantis DOI: 10.1504/IJMPT.2009.022411
188-199	Development of cryogenic power modules for superconducting hybrid power electronic system Hua Ye, Changwoo Lee, Randy W. Simon, Pradeep Haldar DOI: 10.1504/IJMPT.2009.022412
200-213	A study of mechanical and thermal properties of materials in electronic packaging: application of micro DIC Dongsheng Zhang, Chenglin Lu, Peng Lu, Dwayne Arola DOI: 10.1504/IJMPT.2009.022413