Editor in Chief

• Gunasekaran, Angappa, Penn State Harrisburg, USA
  (an.gunasekarangmail.com)

Associate Editors

• Koh, Siau Ching Lenny, University of Sheffield, UK
• Su, Xuemei, California State University - Long Beach, USA

Editorial Board Members

• Akinc, Umit, Wake Forest University, USA
• Armony, Mor, New York University, USA
• Ashayeri, Jalal, Tilburg University, Netherlands
• Aviv, Yossi, Washington University, USA
• Axsäter, Sven, Lund University, Sweden
• Batta, Rajan, University at Buffalo (SUNY), USA
• Bhansali, Rajendra, University of Liverpool, UK
• Bichler, Martin, Technical University of Munich, Germany
• Booth, David E., Kent State University, USA
• Cavalier, Tom, Penn State University, USA
• Chen, Bo, University of Warwick, UK
• Chien, Chen-Fu, National Tsing Hua University, Taiwan, Province of China
• Clarke, John-Paul, Massachusetts Institute of Technology, USA
• Clausen, Jens, Technical University of Denmark, Denmark
• Ferrell, Jr., William G., Clemson University, USA
• Foulds, Les, University of Waikato, New Zealand
• Gan, Xianghua, Hong Kong Polytechnic University, Hong Kong SAR, China
• Garg, Amit, Siebel Systems, USA
• Gilbert, Kenneth, University of Tennessee, USA
• Glover, Fred, University of Colorado , USA
• Greene, Timothy J., Western Michigan University, USA
• Heching, Aliza, IBM TJ Watson Research Laboratory, USA
• Hlynka, Myron, University of Windsor, Canada
• Karaesmen Aydin, Itir Z., American University, USA
• Ketikidis, Panayiotis H., University of Sheffield International Faculty, CITY College, Greece
• Korhonen, Pekka, Helsinki School of Economics, Finland
• Lane, David C., London School of Economics and Political Science, UK
• Lee, W. B., The Hong Kong Polytechnic University, Hong Kong SAR, China
• Maroto, Concepción, Universidad Politécnica de Valencia, Spain
• McAllister, David, North Carolina State University, USA
• Melachrinoudis, Emanuel, Northeastern University, USA
• Miller, John O., Air Force Institute of Technology, USA
• Mitchell, John, Rensselaer Polytechnic Institute, USA
• Moore, James T., Air Force Institute of Technology, USA
• O'Grady, Peter, University of Iowa, USA
• Olafsson, Sigurdur, Iowa State University, USA
• Oren, Shmuel, University of California at Berkeley, USA
• Pardalos, Panos M., University of Florida, USA
• Parsaei, Hamid R., University of Houston, USA
• Persona, Alessandro, University of Padua, Italy
• Prabhu, Nagabhushana, Purdue University, USA
• Ryan, David M., University of Auckland, New Zealand
• Słowiński, Roman, Poznan University of Technology, Poland
• Saad, Sameh, Sheffield Hallam University, UK
• Solow, Danny, Case Western Reserve University, USA
• Sriskandarajah, Chelliah, University of Texas at Dallas, USA
• Taaffe, Kevin, Clemson University, USA
• Thomas, Lyn, University of Southampton, UK
• Thompson, Jonathan, Cardiff University, UK
• Tirtiroglu, Ercan, University of Adelaide, Australia
• Tromeur-Dervout, Damien, University Lyon 1, France
• Young, Robert, North Carolina State University, USA
• Yousefsibdari, Soheil, University of Massachusetts - Dartmouth, USA
• Yucesan, Enver, INSEAD, France
• Zabinsky, Zelda, University of Washington, USA

A few essentials for publishing in this journal

• Submitted articles should not have been previously published or be currently under consideration for publication elsewhere.
• Conference papers may only be submitted if the paper has been completely re-written (more details available here) and the author has cleared any necessary permissions with the copyright owner if it has been previously copyrighted.
• Briefs and research notes are not published in this journal.
• All our articles go through a double-blind review process.
• All authors must declare they have read and agreed to the content of the submitted article. A full statement of our Ethical Guidelines for Authors (PDF) is available.
• There are no charges for publishing with Inderscience, unless you require your article to be Open Access (OA). You can find more information on OA here.



Submission process

• All articles for this journal must be submitted using our online submissions system.
• View Author guidelines.
• Submit here.