Editor in Chief

• Luo, Yan, NCUT, USA
  (ijcaetgmail.com)

Regional Editor Australia

• Chen, Wensu, Curtin University, Australia

Regional Editor East Europe

• Niculiu, Tudor, University Politehnica of Bucharest, Romania

Regional Editor East Asia

• Chin, Kwai Sang, City University of Hong Kong, Hong Kong SAR, China

Regional Editors India

• Gupta, Chetna, Jaypee Institute of Information Technology, India
• Gupta, Varun, Jawaharlal Nehru Government Engineering College, India
• Tiwari, Manoj Kumar, Indian Institute of Technology, India

Regional Editor North America

• Nguyen, Duc, Old Dominion University , USA

Regional Editor North Asia

• Fu, Ming Wang, Hong Kong Polytechnic University, Hong Kong SAR, China

Regional Editors South America

• Khalil, R., De Montfort University, UK
• Wan Yusoff, Wan Ahmad Yusmawiza, Islamic University of Madinah, Saudi Arabia

Regional Editors South-Asia

• Kannan, Ramani, Universiti Teknologi PETRONAS, Malaysia
• Pham, Tuan D., Prince Mohammad Bin Fahd University, Saudi Arabia

Regional Editor Western Europe

• Case, Keith, Loughborough University, UK

Editorial Board Members

• Al-Qutayri, Mahmoud, Khalifa University of Science, Technology and Research (KUSTAR), United Arab Emirates
• Anumba, Chimay J., Pennsylvania State University, USA
• Babic, Slobodan, Ecole Polytechnique de Montreal, Canada
• Barari, Amin, Aalborg University , Denmark
• Bideaux, Eric, Institut National des Sciences Appliquees de Lyon (INSA Lyon), France
• Bobeanu, Carmen-Veronica, Ghent University, Belgium
• Bouzakis, K. D., Aristotle University of Thessaloniki, Greece
• Bruha, Ivan, McMaster University, Canada
• Cabrera, Francisco Mata, University of Castilla-La Mancha, Spain
• Chen, Min, University of Wales Swansea, UK
• Cotofana, Sorin, Universiteit Delft, Netherlands
• Currie, Kenneth, Tennessee Technological University, USA
• Diegel, Olaf, Lund University, Sweden
• Farella, Elisabetta, University of Bologna, Italy
• Feliz-Teixeira, J. Manuel, University of Porto, Portugal
• Gao, Xiao-Zhi, University of Eastern Finland, Finland
• Garcia Adeva, Juan Jose, University of the Basque Country, Spain
• Grzech, Adam, Wroclaw University of Technology, Poland
• Huang, George Q., The University of Hong Kong, Hong Kong SAR, China
• Jeong, Haedo, Pusan National University, South Korea
• Koskinen, Kari T., Tampere University of Technology, Finland
• Kusiak, Andrew, University of Iowa, USA
• Lastra, José Luis Martinez, Tampere University of Technology, Finland
• Lawrence, Peter, Swinburne University, Australia
• Liang, Steven Y., Georgia Institute of Technology, USA
• Lim, Chu, Intel Corporation, USA
• Mebrahtu, Habtom, Anglia Ruskin University, UK
• Mohammed, Sabah, Lakehead University, Canada
• Mori, Masahiko, Mori Seiki Co., Ltd., Japan
• Nee, Andrew Yeh-Ching, National University of Singapore, Singapore
• Nketsa, Alexandre, Paul Sabatier University, France
• Oliveira, Joao F.G., IPT - Instituto de Pesquisas Tecnológicas do Estado de SP, Brazil
• Pham, D. T., University of Birmingham, UK
• Piramuthu, Selwyn, University of Florida, USA
• Rahem, Ahmed, CNRC-CTA / NRC-ATC, Canada
• Rajurkar, Kamlakar P., University of Nebraska Lincoln, USA
• Ren, Wei, National Institute of Standards and Technology, USA
• Rothkrant, L.J.M., Delft University of Technology, Netherlands
• Sapidis, Nickolas S., University of Western Macedonia, Greece
• Schuetzer, Klaus, Methodist University of Piracicaba, Brazil
• Stanik, Markus, Elb-Schliff Werkzeugmaschinen GmbH / aba Grinding Technologies GmbH, Germany
• Stecke, Kathryn E., University of Texas at Dallas, USA
• Stratil, Paul, Daimler AG, Germany
• Taufik, Syahril, Lambung Mangkurat University, Indonesia
• Turk, Žiga, University of Ljubljana, Slovenia
• Wakjira, Tadesse G., University of British Columbia, Canada
• Walker, Rob, The Institution of Engineering and Technology, UK
• Wright, Paul K., University of California at Berkeley, USA
• Xi, Jeff, Ryerson University, Canada
• Xu, Xun William, University of Auckland, New Zealand
• Yamazaki, Kazuo, University of California, Davis, USA
• Zhu, Huabing, Hefei University of Technology, China

A few essentials for publishing in this journal

• Submitted articles should not have been previously published or be currently under consideration for publication elsewhere.
• Conference papers may only be submitted if the paper has been completely re-written (more details available here) and the author has cleared any necessary permissions with the copyright owner if it has been previously copyrighted.
• Briefs and research notes are not published in this journal.
• All our articles go through a double-blind review process.
• All authors must declare they have read and agreed to the content of the submitted article. A full statement of our Ethical Guidelines for Authors (PDF) is available.
• This is an Open Access-only journal. There is an article processing charge of US $1200 to publish in this journal. You can find more information on Open Access here. Authors who have submitted articles prior to 1 March, 2020 will still have a choice of publishing as a Standard or an Open-Access article.



Submission process

• All articles for this journal must be submitted using our online submissions system.
• View Author guidelines.
• Submit here.