Editor in Chief

• Gupta, Varun, GISMA University of Applied Sciences, Germany
  (eic.ijcaetgmail.com)

Regional Editor Australia

• Chen, Wensu, Curtin University, Australia

Regional Editor East Europe

• Niculiu, Tudor, University Politehnica of Bucharest, Romania

Regional Editor East Asia

• Chin, Kwai Sang, City University of Hong Kong, Hong Kong SAR, China

Regional Editors India

• Gupta, Chetna, Jaypee Institute of Information Technology, India
• Tiwari, Manoj Kumar, Indian Institute of Technology, India

Regional Editor North America

• Nguyen, Duc, Old Dominion University , USA

Regional Editor North Africa

• Bennour, Akram, University of Tebessa, Algeria

Regional Editor North Asia

• Fu, Ming Wang, Hong Kong Polytechnic University, Hong Kong SAR, China

Regional Editors South America

• Khalil, R., De Montfort University, UK
• Wan Yusoff, Wan Ahmad Yusmawiza, Islamic University of Madinah, Saudi Arabia

Regional Editors South Asia

• Kannan, Ramani, Universiti Teknologi PETRONAS, Malaysia
• Pham, Tuan D., Prince Mohammad Bin Fahd University, Saudi Arabia

Editorial Board Members

• Al-Qutayri, Mahmoud, Khalifa University of Science, Technology and Research (KUSTAR), United Arab Emirates
• Anumba, Chimay J., Pennsylvania State University, USA
• Babic, Slobodan, Ecole Polytechnique de Montreal, Canada
• Barari, Amin, Aalborg University , Denmark
• Bideaux, Eric, Institut National des Sciences Appliquees de Lyon (INSA Lyon), France
• Bobeanu, Carmen-Veronica, Ghent University, Belgium
• Bouzakis, K. D., Aristotle University of Thessaloniki, Greece
• Bruha, Ivan, McMaster University, Canada
• Cabrera, Francisco Mata, University of Castilla-La Mancha, Spain
• Chen, Min, University of Wales Swansea, UK
• Cotofana, Sorin, Universiteit Delft, Netherlands
• Currie, Kenneth, Tennessee Technological University, USA
• Diegel, Olaf, Lund University, Sweden
• Farella, Elisabetta, University of Bologna, Italy
• Feliz-Teixeira, J. Manuel, University of Porto, Portugal
• Gao, Xiao-Zhi, University of Eastern Finland, Finland
• Garcia Adeva, Juan Jose, University of the Basque Country, Spain
• Grzech, Adam, Wroclaw University of Technology, Poland
• Huang, George Q., Hong Kong Polytechnic University, Hong Kong SAR, China
• Jeong, Haedo, Pusan National University, South Korea
• Koskinen, Kari T., Tampere University of Technology, Finland
• Kusiak, Andrew, University of Iowa, USA
• Lastra, José Luis Martinez, Tampere University of Technology, Finland
• Lawrence, Peter, Swinburne University, Australia
• Liang, Steven Y., Georgia Institute of Technology, USA
• Lim, Chu, Intel Corporation, USA
• Marir, Toufik, University of Oum El Bouaghi, Algeria
• Mebrahtu, Habtom, Anglia Ruskin University, UK
• Menassel, Yahia, Echahid Cheikh Larbi Tebessi University, Algeria
• Mohammed, Sabah, Lakehead University, Canada
• Mori, Masahiko, Mori Seiki Co., Ltd., Japan
• Nee, Andrew Yeh-Ching, National University of Singapore, Singapore
• Nketsa, Alexandre, Paul Sabatier University, France
• Oliveira, Joao F.G., IPT - Instituto de Pesquisas Tecnológicas do Estado de SP, Brazil
• Pham, D. T., University of Birmingham, UK
• Piramuthu, Selwyn, University of Florida, USA
• Rahem, Ahmed, CNRC-CTA / NRC-ATC, Canada
• Rajurkar, Kamlakar P., University of Nebraska Lincoln, USA
• Ren, Wei, National Institute of Standards and Technology, USA
• Rothkrant, L.J.M., Delft University of Technology, Netherlands
• Sapidis, Nickolas S., University of Western Macedonia, Greece
• Schuetzer, Klaus, Methodist University of Piracicaba, Brazil
• Stanik, Markus, Elb-Schliff Werkzeugmaschinen GmbH / aba Grinding Technologies GmbH, Germany
• Stecke, Kathryn E., University of Texas at Dallas, USA
• Stratil, Paul, Daimler AG, Germany
• Taufik, Syahril, Lambung Mangkurat University, Indonesia
• Turk, Žiga, University of Ljubljana, Slovenia
• Wakjira, Tadesse G., University of British Columbia, Canada
• Walker, Rob, The Institution of Engineering and Technology, UK
• Wang, Xiaolei, LAB University of Applied Sciences, Finland
• Wright, Paul K., University of California at Berkeley, USA
• Wu, Han, Chang'an University, China
• Xi, Jeff, Ryerson University, Canada
• Xu, Xun William, University of Auckland, New Zealand
• Yamazaki, Kazuo, University of California, Davis, USA
• Zhu, Huabing, Hefei University of Technology, China

A few essentials for publishing in this journal

• Submitted articles should not have been previously published or be currently under consideration for publication elsewhere.
• Conference papers may only be submitted if the paper has been completely re-written (more details available here) and the author has cleared any necessary permissions with the copyright owner if it has been previously copyrighted.
• Briefs and research notes are not published in this journal.
• All our articles go through a double-blind review process.
• All authors must declare they have read and agreed to the content of the submitted article. A full statement of our Ethical Guidelines for Authors (PDF) is available.
• This is an Open Access-only journal. There is an article processing charge of USD $1600 to publish in this journal. You can find more information on Open Access here. For authors who have submitted articles prior to 15 August 2024, the previous charge of USD $1200 applies.



Submission process

• All articles for this journal must be submitted using our online submissions system.
• View Author guidelines.
• Submit here.