International Journal of Machining and Machinability of Materials (IJMMM)

International Journal of Machining and Machinability of Materials

2007 Vol.2 No.1

Special Issue on Ultraprecision Machining of Optoelectronic Materials

Guest Editor: Prof. Jiwang Yan

Editorial

Pages Title and author(s)
3-16Nanomachining Zr-based metallic glass surfaces using an atomic force microscope
Noritaka Kawasegi, Noboru Morita, Shigeru Yamada, Noboru Takano, Tatsuo Oyama, Kiwamu Ashida, Hitoshi Ofune
DOI: 10.1504/IJMMM.2007.012663
17-36Ductile to brittle transition depths for CVD silicon carbide and quartz
Biswarup Bhattacharya, John Patten, Jerry Jacob
DOI: 10.1504/IJMMM.2007.012664
37-49Grain exfoliation and control thereof in ultra-precision plane honing of AlN substrates
Shinya Suzuki, Tsunemoto Kuriyagawa, Jiwang Yan, Nobuhito Yoshihara
DOI: 10.1504/IJMMM.2007.012665
50-58Research on material removal of ultrasonic-magnetorheological compound finishing
Huijun Wang, Feihu Zhang, Yong Zhang, Dianrong Luan
DOI: 10.1504/IJMMM.2007.012666
59-70A method for microstructures fabrication by using micro-EDM
Yong Zhang, Zhenlong Wang, Zhiyong Li, Wansheng Zhao
DOI: 10.1504/IJMMM.2007.012667
71-84Nanometric grinding of axisymmetric aspherical mould inserts for optic/photonic applications
Han Huang, Tsunemoto Kuriyagawa
DOI: 10.1504/IJMMM.2007.012668
85-963D simulation of arc envelope grinding of non-axisymmetric aspheric surface
J. Xie, W.W. Xu, J. Tamaki
DOI: 10.1504/IJMMM.2007.012669
97-107Affected layer evaluation of ultraprecise machined surface using magnetic force microscopy
Yoshio Ichida, Yoshitaka Morimoto, Ryunosuke Sato
DOI: 10.1504/IJMMM.2007.012670
108-124Prediction of subsurface damage depth of ground brittle materials by surface profiling
Tsutomu Ohta, Jiwang Yan, Tsunemoto Kuriyagawa, Sunao Kodera, Tomoaki Nakasuji
DOI: 10.1504/IJMMM.2007.012671
125-142Non-destructive evaluation methods for subsurface damage in silicon wafers: a literature review
Weike Lu, Z.J. Pei, J.G. Sun
DOI: 10.1504/IJMMM.2007.012672

 

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