International Journal of Machining and Machinability of Materials
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International Journal of Machining and Machinability of Materials (2 papers in press)
Quality improvement in mechanical micro drilling of titanium alloy under dry conditions by Somashekhar S. Hiremath, Prashanth P Abstract: Titanium alloy (CpTi) grade II is considered a hard-to-cut material due to low thermal conductivity, work hardening behavior, and affinity with cutting tool materials. In this study, micro-holes are machined on titanium alloy (Cp Ti) grade II under dry conditions. Experiments are carried out by varying the machining parameters like cutting speed (5 m/min, 6.9 m/min, and 8.8 m/min), feed (5 Keywords: mechanical micro-drilling; exit burr height; taper angle; response surface methodology; exit thrust force; titanium alloy (Cp – Ti) grade –II.
Effect of Nano-void Position on Surface Integrity in Nanomachining of Single Crystal Copper by Seyed Vahid Hosseini, Mehdi Heidari, Hadi Parvaz, Mehrdad Vahdati Abstract: In this paper, molecular dynamics simulations were performed to study the effect of nano-size voids in different locations relative to the surface on nanomachining characteristics and surface integrity. Using EAM potential, MD simulations were performed with two approaches: material removal and relaxation of the work material, to find a low defect permanent configuration after the rigid tool has traversed the machined area. Results show that high hydrostatic pressure induced by tool edge diffuses atoms into the void during the machining process. Investigation of residual stress for subsurface void workpiece represents that higher compressive stress remains in the surface due to the tendency of void for spring back. Besides, in the nanomachining process, surface atoms are greatly disordered and dislocation loops glide deep into substrate atoms. After relaxation, if void pitting contains no other atoms, the machined surface is reorganized as FCC lattice similar to a pure workpiece. Keywords: Nanomachining; Molecular dynamics; Nano-void; Residual stress; Surface integrity.