Login Help Sitemap
Inderscience Publishers - linking academia, business and industry through research
  • Home
  • For Authors
  • For Librarians
  • Orders
  • Inderscience Online
  • News
  1. International Journal of Earthquake and Impact Engineering
  2. Published issues
  3. 2017 Vol.2 No.1
International Journal of Earthquake and Impact Engineering (IJEIE)

International Journal of Earthquake and Impact Engineering

2017 Vol.2 No.1


Pages Title and author(s)
1-31Effects of vertical irregularities and construction quality in seismic fragilities for reinforced concrete buildings
Pathmanathan Rajeev; Solomon Tesfamariam
DOI: 10.1504/IJEIE.2017.083704
32-45Closed-form rocking vibration of rigid block under critical and non-critical double impulse
Ryo Taniguchi; Kunihiko Nabeshima; Kotaro Kojima; Izuru Takewaki
DOI: 10.1504/IJEIE.2017.083708
46-66Implications of adopting different force reductions in seismic design of RC buildings
Aman Mwafy; Hilal Mahmoud
DOI: 10.1504/IJEIE.2017.083716
67-87Optimal damper placement in hybrid control system of multiple isolation and building connection
Goki Tamura; Masaki Taniguchi; Kohei Fujita; Masaaki Tsuji; Izuru Takewaki
DOI: 10.1504/IJEIE.2017.083718

 

  • Sign up for new issue alerts
  • Subscribe/buy articles/issues
  • View sample articles
  • Copyright and author entitlement
  • Forthcoming articles
  • Journal information in easy print format (PDF)
  • Publishing with Inderscience: ethical statement
  • Recommend to a librarian (PDF)
  • Feedback to Editor
  • Get permission to reproduce content
  • Find related journals
Keep up-to-date
  • BlogOur Blog
  • Join us on BlueskyJoin us on Bluesky
  • Follow us on XFollow us on X
  • FacebookVisit us on Facebook
  • Our Newsletter (subscribe for free)
  • RSS Feeds
  • New issue alerts
  • Inderscience is a member of publishing organisations including:
  • CrossRef
  • CLOCKSS
Return to top
  • Contact us
  • About Inderscience
  • OAI Repository
  • Privacy and Cookies Statement
  • Terms and Conditions
  • Help
  • Sitemap
  • © Inderscience Enterprises Ltd.