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International Journal of Abrasive Technology

2010 Vol. 3 No. 3

 

PagesTitle and authors
175-189Development of a high-frequency pulse laser irradiation system for repairing silicon wafers damaged by abrasive machining processes
Jiwang Yan, Seiya Muto, Tsunemoto Kuriyagawa
DOI: 10.1504/IJAT.2010.034049

190-202A feasibility study on elliptical ultrasonic assisted grinding of sapphire substrate
Zhiqiang Liang, Xibin Wang, Wenxiang Zhao, Yongbo Wu, Takashi Sato, Weimin Lin
DOI: 10.1504/IJAT.2010.034050

203-214Optimisation of D2 steel lapping with a polymer plate
Yiying Zhang, Ioan D. Marinescu, Rick VandenBoom
DOI: 10.1504/IJAT.2010.034051

215-227Performance of abrasives used in magnetically assisted finishing: a state of the art review
Lakhvir Singh, Sehijpal Singh Khangura, P.S. Mishra
DOI: 10.1504/IJAT.2010.034052

228-237Polishing properties of porous silica abrasive on hard disk substrate CMP
Ping Liu, Hong Lei, RuLing Chen
DOI: 10.1504/IJAT.2010.034053

238-258Depth of cut models for multipass abrasive waterjet cutting of alumina ceramics
Jingming Fan
DOI: 10.1504/IJAT.2010.034054

259-273Comparative grindability study of composite ceramic and conventional ceramic
Vivek Kumar Verma, Vijayender Singh, Sudarsan Ghosh
DOI: 10.1504/IJAT.2010.034055