| Pages | Title and authors |
| 175-189 | Development of a high-frequency pulse laser irradiation system for repairing silicon wafers damaged by abrasive machining processes
Jiwang Yan, Seiya Muto, Tsunemoto Kuriyagawa
DOI: 10.1504/IJAT.2010.034049 |
| 190-202 | A feasibility study on elliptical ultrasonic assisted grinding of sapphire substrate
Zhiqiang Liang, Xibin Wang, Wenxiang Zhao, Yongbo Wu, Takashi Sato, Weimin Lin
DOI: 10.1504/IJAT.2010.034050 |
| 203-214 | Optimisation of D2 steel lapping with a polymer plate
Yiying Zhang, Ioan D. Marinescu, Rick VandenBoom
DOI: 10.1504/IJAT.2010.034051 |
| 215-227 | Performance of abrasives used in magnetically assisted finishing: a state of the art review
Lakhvir Singh, Sehijpal Singh Khangura, P.S. Mishra
DOI: 10.1504/IJAT.2010.034052 |
| 228-237 | Polishing properties of porous silica abrasive on hard disk substrate CMP
Ping Liu, Hong Lei, RuLing Chen
DOI: 10.1504/IJAT.2010.034053 |
| 238-258 | Depth of cut models for multipass abrasive waterjet cutting of alumina ceramics
Jingming Fan
DOI: 10.1504/IJAT.2010.034054 |
| 259-273 | Comparative grindability study of composite ceramic and conventional ceramic
Vivek Kumar Verma, Vijayender Singh, Sudarsan Ghosh
DOI: 10.1504/IJAT.2010.034055 |
