Editor in Chief

• Damodaran, Purushothaman, Northern Illinois University, USA
  (pdamodaran.ijssca.editoroutlook.com)

Associate Editor

• Panneerselvam, R., Pondichery University, India

Associate Editor Manufacturing

• Besseris, George, University of West Attica, Greece

Associate Editor Services

• Yang, Kai, Wayne State University, USA

Editorial Board Members

• Agustiady, Tina, BASF, USA
• Cudney, Elizabeth Anne, Missouri University of Science and Technology, USA
• Edgeman, Rick L., Aarhus University, Denmark
• Etienne, Eisenhower, Florida A&M University, USA
• Grabenstetter, Doug, Milwauke School of Engineering, USA
• Mitra, Amit, Auburn University, USA
• Nithyanandam, Ganesh, PSG College of Technology, India
• Rajendran, Chandrasekharan, Indian Institute of Technology Madras, India
• Rathi, Rajeev, Lovely Professional University, India
• Suresh, M., Amrita Vishwa Vidyapeetham University, India
• Yadav, Om Prakash, North Dakota State University, USA
• Yeung, Shirley Mo-Ching, Gratia Christian College, Hong Kong SAR, China

A few essentials for publishing in this journal

• Submitted articles should not have been previously published or be currently under consideration for publication elsewhere.
• Conference papers may only be submitted if the paper has been completely re-written (more details available here) and the author has cleared any necessary permissions with the copyright owner if it has been previously copyrighted.
• Briefs and research notes are not published in this journal.
• All our articles go through a double-blind review process.
• All authors must declare they have read and agreed to the content of the submitted article. A full statement of our Ethical Guidelines for Authors (PDF) is available.
• There are no charges for publishing with Inderscience, unless you require your article to be Open Access (OA). You can find more information on OA here.



Submission process

• All articles for this journal must be submitted using our online submissions system.
• View Author guidelines.
• Submit here.