Editor in Chief

• Wang, John, Montclair State University, USA
  (j.john.wanggmail.com)

Managing Editor

• Shi, Xin, Manchester Metropolitan University, UK

Associate Editors

• Afsharian, Mohsen, Technische Universität Braunschweig, Germany
• Ashley, Richard, Virginia Tech, USA
• Bose, Indranil, University of Hong Kong, Hong Kong SAR, China
• Smirnov, Alexander, Russian Academy of Sciences (SPIIRAS), Russian Federation
• Su, Chao-Ton, National Tsing Hua University, Taiwan
• Zopounidis, Constantin, Audencia Nantes School of Management, France and Technical University of Crete, Greece

American Editor

• Seetharaman, P.B. (Seethu), Rice University, USA

Assistant Editor

• Zhai, Qingqing, Shanghai University, China

European Editor

• Berrah, Lamia, Universite de Savoie, France

Far East Editor

• Feng, Ling, Tsinghua University, China

Japanese Editor

• Morita, Hiroshi, Osaka University, Japan

Editorial Board Members

• Abidin, Shafiqul, Northern India Engineering College, India
• Alinejad-Rokny, Hamid, University of New South Wales, Australia
• Anagun, Sermet, Eskisehir Osmangazi University, Turkey
• Arumugam, Sathya, Sathyabama University, India
• Audrino, Francesco, University of St. Gallen, Switzerland
• Ayyalasomayajula, Premnath, Travelers Indemnity Co., USA
• Bagui, Sikha, University of West Florida, USA
• Baykasoglu, Adil, Dokuz Eylul University, Turkey
• Brena, Ramon, Tecnologico de Monterrey, Mexico
• Buccafurri, Francesco, Università Mediterranea di Reggio Calabria, Italy
• Canbolat, Mustafa S., State University of New York at Brockport, USA
• Carnero, Carmen, University of Castilla-La Mancha, Spain
• Ceci, Michelangelo, Università degli Studi di Bari, Italy
• Chandra, Charu, University of Michigan – Dearborn, USA
• Chin, Wen Cheong, Multimedia University, Malaysia
• Chung, William, City University of Hong Kong, Hong Kong SAR, China
• Daniel, Ben Kei, University of Otago, New Zealand
• Fang, Yi, Santa Clara University, USA
• Feng, Shuaizhang, Shanghai University of Finance and Economics, China
• Ghobaei-Arani, Mostafa, Islamic Azad University, Iran
• Giraud-Carrier, Christophe, Brigham Young University, USA
• Gupta, Anamika, University of Delhi, India
• Han, Qian, Deloitte LLP, USA
• Hao, Wei, New Jersey Institute of Technology, USA
• Hariharan, Shanmugasundaram, Saveetha Engineering College, India
• HM Krishna Prasad, Munaga, University College of Engineering Kakinada, JNTUK, India
• Hu, Yueqin, Texas State University, USA
• Huang, Wenxue, Guangzhou University, China
• Huang, Xiangji Jimmy, York University, Canada
• Huang, Yung-Fu, Chaoyang University of Technology, Taiwan
• Hui, Tak-Kee, SIM University, Singapore
• Huq, Faizul, Ohio University, USA
• Hwang, Seung-won, POSTECH, South Korea
• Iam-On, Natthakan, Mae Fah Luang University, Thailand
• Juan, Angel, Open University of Catalonia, Spain
• Kalles, Dimitris, Hellenic Open University, Greece
• Khan K, Arif, Vertex Data Science, India
• Khoo, Siau Cheng, National University of Singapore, Singapore
• Khouri, Selma, Ecole nationale Supérieure d'Informatique, Algeria
• Kline, Douglas M., UNC Wilmington, USA
• Koyuncu, Nursel, Hacettepe University, Turkey
• Kretowski, Marek, Bialystok Technical University, Poland
• Kumar, Ashwani, Indian Institute of Management, India
• Laitinen, Erkki K., University of Vaasa, Finland
• Lee, Thomas, University of Illinois, USA
• Li, Guang, The Electric Reliability Council of Texas (ERCOT), USA
• Li, Zhenping, Beijing Wuzi University, China
• Liberati, Diego, Italian National Research Council, Italy
• Liu, Rong, University of California, Los Angeles, USA
• Liu, Ying, University of Minnesota, USA
• Luo, Jiangtao, University of Nebraska Medical Center, USA
• Mahboubi, Hadj, Cemagref-Clermont-Ferrand, France
• Malhotra, Rashmi, Saint Joseph's Univeristy, USA
• Mathiyalakan, Sathasivam, Winston Salem State University, USA
• Meisel, Stephan, Technical University of Braunschweig, Germany
• Mendes, Armando Brito, Universidade dos Açores, Portugal
• Mishra, Sambit Kumar, Biju Patnaik University of Technology, Rourkela, India
• Mohebbi, Esmail, University of West Florida, USA
• Nag, Barin, Towson University, USA
• Nandigam, Ravi, Aspen Technology Inc., USA
• Özel, Gamze, Hacettepe University, Turkey
• Oztekin, Asil, University of Massachusetts Lowell, USA
• Pabreja, Kavita, Maharaja Surajmal Institute, India
• Pal, Bijay Baran, University of Kalyani, India
• Papaioannou, Grammatoula, Loughborough University, UK
• Pargar, Farzad, University of Oulu, Finland
• Phillips-Wren, Gloria, Loyola University Maryland, USA
• Qiu, Dingxi, University of Miami, USA
• Ravi, V., Institute for Development and Research in Banking Technology (IDRBT), India
• Raviv, Yaron, Claremont McKenna College, USA
• Reddivari, Sandeep, University of North Florida, USA
• Rokach, Lior, Ben-Gurion University of the Negev, Israel
• Samaranayake, Premaratne, University of Western Sydney, Australia
• Savsar, Mehmet, Kuwait University, Kuwait
• Scime, Anthony, State University of New York College at Brockport, USA
• Sharma, Sujeet K., Indian Institute of Management Tiruchirappalli, India
• Shoorbakhloo, Mohammad Sadegh Mirzaei, University of Applied Science and Technology, Iran
• Škulj, Damjan, University of Ljubljana, Slovenia
• Sowlati, Taraneh, University of British Columbia, Canada
• Srinivasan, Rajagopalan, Indian Institute of Technology Madras, India
• Stoica, Eduard, Lucian Blaga University of Sibiu, Romania
• Theodorou, Petros, Public Power Corporation S.A. (DEI), Greece
• Verma, Basant, IET ALWAR, India
• Wang, Haizhong, Oregon State University, USA
• Wang, Shouhong, University of Massachusetts Dartmouth, USA
• Wee, Hui Ming, Chung Yuan Christian University, Taiwan
• Xiang, Yang, University of Guelph, Canada
• Xiao, Tiaojun, Nanjing University, China
• Xu, Zeshui, PLA University of Science and Technology, China
• Yan, Ruiliang, Texas A&M University – Commerce, USA
• Yang, I-Tung, National Taiwan University of Science and Technology, Taiwan
• Yeh, Wei-Chang, National Tsing Hua University, Taiwan
• Zararsiz, Gokmen, Erciyes University, Turkey
• Zhang, Jinzhong, FutureWei Technology, USA
• Zhang, Qingyu, Arkansas State University, USA
• Zhao, Peng, Saint Peter's University, USA
• Zhou, Li, University of Greenwich, UK

A few essentials for publishing in this journal

• Submitted articles should not have been previously published or be currently under consideration for publication elsewhere.
• Conference papers may only be submitted if the paper has been completely re-written (more details available here) and the author has cleared any necessary permissions with the copyright owner if it has been previously copyrighted.
• Briefs and research notes are not published in this journal.
• All our articles go through a double-blind review process.
• All authors must declare they have read and agreed to the content of the submitted article. A full statement of our Ethical Guidelines for Authors (PDF) is available.
• There are no charges for publishing with Inderscience, unless you require your article to be Open Access (OA). You can find more information on OA here.

Submission process

• All articles for this journal must be submitted using our online submissions system.
• Submit here.