International Journal of Manufacturing Technology and Management (IJMTM)

International Journal of Manufacturing Technology and Management

2005 Vol.7 No.5/6

Special Issue on Advances in Manufacturing of Semiconductor Materials

Guest Editors: Professor Z.J. Pei and Dr. Graham R. Fisher


Pages Title and author(s)
407-429Computational model for the steady-state elasto-hydrodynamic interaction in wafer slicing process using wiresaw
Liqun Zhu, Imin Kao
DOI: 10.1504/IJMTM.2005.007694
430-440In-process force monitoring for precision grinding semiconductor silicon wafers
Jeremiah A. Couey, Eric R. Marsh, Byron R. Knapp, R. Ryan Vallance
DOI: 10.1504/IJMTM.2005.007695
441-454A novel fixed abrasive process: chemo-mechanical grinding technology
Libo Zhou, Jun Shimizu, Hiroshi Eda
DOI: 10.1504/IJMTM.2005.007696
455-466Molecular dynamics simulation of the effect of tool edge radius on cutting forces and cutting region in nanoscale ductile cutting of silicon
M.B. Cai, X.P. Li, M. Rahman
DOI: 10.1504/IJMTM.2005.007697
467-489Yield improvement via minimisation of step height non-uniformity in chemical mechanical planarisation (CMP) with pressure and velocity as control variables
Muthukkumar S. Kadavasal, Abhijit Chandra, Sutee Eamkajornsiri, Ashraf -F. Bastawros
DOI: 10.1504/IJMTM.2005.007698
490-503Effects of tool stiffness and infeed scheme on planarisation. (Integrated model for simulation of planarisation process)
Libo Zhou, Jun Shimizu, Hiroshi Eda
DOI: 10.1504/IJMTM.2005.007699
504-529Modelling and analysis of pad surface topography and slurry particle size distribution effects on material removal rate in chemical mechanical planarisation
Changxue Wang, Peter Sherman, Abhijit Chandra
DOI: 10.1504/IJMTM.2005.007700
530-539In-situ infrared detection and heating of metallic phase of silicon during scratching test
Lei Dong, John A. Patten, Jimmie A. Miller
DOI: 10.1504/IJMTM.2005.007701
540-552Quantitative assessment of subsurface damage depth in silicon wafers based on optical transmission properties
J.M. Zhang, J.G. Sun
DOI: 10.1504/IJMTM.2005.007702
553-565Fabrication of pin diodes using direct-bonded silicon wafers
Iqbal K. Bansal, Mark Surgent
DOI: 10.1504/IJMTM.2005.007703
566-580Selecting and developing suppliers for mass merchandisers
Kee S. Kim, Stephen C. Jones, Tami L. Knotts
DOI: 10.1504/IJMTM.2005.007704
581-593Allocation of parts to cells, minimising tardiness and idle time by simulated annealing
R. Tavakkoli-Moghaddam, M. Rabbani, A. Ghodratnama, P.K. Ahmed
DOI: 10.1504/IJMTM.2005.007705