Non-destructive evaluation methods for subsurface damage in silicon wafers: a literature review
by Weike Lu, Z.J. Pei, J.G. Sun
International Journal of Machining and Machinability of Materials (IJMMM), Vol. 2, No. 1, 2007

Abstract: The Subsurface Damage (SSD) in silicon wafers induced by any mechanical material-removal processes has to be removed by subsequent processes. Therefore, the measurement of SSD is critically important for cost-effective manufacturing of silicon wafers. This review paper presents several Non-Destructive Evaluation (NDE) methods for SSD in silicon wafers, including X-ray diffraction, micro-Raman spectroscopy, photoluminescence and laser scattering.

Online publication date: Tue, 06-Mar-2007

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