Power monitoring, Fourier transforms of power, and electron microscopy in evaluating the performance of abrasives in grinding Online publication date: Thu, 05-Jan-2017
by Jeffrey A. Badger; Radovan Drazumeric; Peter Krajnik
International Journal of Abrasive Technology (IJAT), Vol. 7, No. 4, 2016
Abstract: The use of electron microscopy and power-monitoring during grinding was investigated in terms of evaluating the fracture and wear characteristics and chip-formation mechanisms of abrasive grains and bond formulations. Diamond abrasives and fused, sintered and sintered triangular-shaped aluminium-oxide abrasives were evaluated. Power was shown to be a useful tool in determining the chip-formation mechanisms and the extent of grit fracture, particularly in triangular-shaped abrasive. Conclusions were supported by electron-microscope analysis. Power was also used to evaluate low-cost diamond vs. premium diamond abrasives. Practical recommendations are given for evaluating grit, wheel and bond performance both in the laboratory and in production.
Online publication date: Thu, 05-Jan-2017
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