Power monitoring, Fourier transforms of power, and electron microscopy in evaluating the performance of abrasives in grinding
by Jeffrey A. Badger; Radovan Drazumeric; Peter Krajnik
International Journal of Abrasive Technology (IJAT), Vol. 7, No. 4, 2016

Abstract: The use of electron microscopy and power-monitoring during grinding was investigated in terms of evaluating the fracture and wear characteristics and chip-formation mechanisms of abrasive grains and bond formulations. Diamond abrasives and fused, sintered and sintered triangular-shaped aluminium-oxide abrasives were evaluated. Power was shown to be a useful tool in determining the chip-formation mechanisms and the extent of grit fracture, particularly in triangular-shaped abrasive. Conclusions were supported by electron-microscope analysis. Power was also used to evaluate low-cost diamond vs. premium diamond abrasives. Practical recommendations are given for evaluating grit, wheel and bond performance both in the laboratory and in production.

Online publication date: Thu, 05-Jan-2017

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Abrasive Technology (IJAT):
Login with your Inderscience username and password:

Username:        Password:          Forgotten your password?

Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com