Title: Power monitoring, Fourier transforms of power, and electron microscopy in evaluating the performance of abrasives in grinding

Authors: Jeffrey A. Badger; Radovan Drazumeric; Peter Krajnik

Addresses: The Grinding Doc, New York, NY, USA; The International Grinding Institute, 127 W. 83rd St., #424, New York, NY 10024, USA ' Faculty of Mechanical Engineering, Univerisity of Ljubljana, Askerceva 6, 1000 Ljubljana, Slovenia; The International Grinding Institute, 127 W. 83rd St., #424, New York, NY 10024, USA ' Department of Materials and Manufacturing Technology, Chalmers University of Technology, Hörsalsvägen 7B, SE-412 96 Gothenburg, Sweden; The International Grinding Institute, 127 W. 83rd St., #424, New York, NY 10024, USA

Abstract: The use of electron microscopy and power-monitoring during grinding was investigated in terms of evaluating the fracture and wear characteristics and chip-formation mechanisms of abrasive grains and bond formulations. Diamond abrasives and fused, sintered and sintered triangular-shaped aluminium-oxide abrasives were evaluated. Power was shown to be a useful tool in determining the chip-formation mechanisms and the extent of grit fracture, particularly in triangular-shaped abrasive. Conclusions were supported by electron-microscope analysis. Power was also used to evaluate low-cost diamond vs. premium diamond abrasives. Practical recommendations are given for evaluating grit, wheel and bond performance both in the laboratory and in production.

Keywords: sintered abrasives; engineered-shape abrasives; grit fracture; wear; chip formation; electron microscopy; power monitoring; Fourier transforms; abrasives performance; abrasive grains; bond formulations; diamond abrasives; aluminium oxide abrasives; grinding wheel performance; bond performance.

DOI: 10.1504/IJAT.2016.081338

International Journal of Abrasive Technology, 2016 Vol.7 No.4, pp.270 - 283

Received: 16 Jan 2016
Accepted: 22 Jan 2016
Published online: 05 Jan 2017 *

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