Calls for papers


International Journal of Materials and Structural Integrity
International Journal of Materials and Structural Integrity


Special Issue on: "Damage Mechanics of Electronic Materials"

Guest Editor: Dr. Leila J. Ladani, Utah State University, USA

This special issue is dedicated to damage in electronic materials; these include solder material, copper pads, semiconductor materials, packaging materials, photonic materials etc. The electronics industry is progressing fast and new materials and applications are introduced daily. Damage to, and reliability of, some of these applications, such as those in aerospace, medical and healthcare, are critical to society.

Subject Coverage
Suitable topics include but are not limited to:
  • Experimental and theoretical studies of damage in electronic materials
  • New damage modelling and simulation techniques
  • Damage prevention in electronic materials
  • Reliability, durability and failure of electronic materials
  • Constitutive modelling of electronic materials
  • Microstructural evolution of electronic materials
  • Damage in micro and nano scale devices

Notes for Prospective Authors

Submitted papers should not have been previously published nor be currently under consideration for publication elsewhere

All papers are refereed through a peer review process. A guide for authors, sample copies and other relevant information for submitting papers are available on the Author Guidelines page

Important Dates

The deadline for submitting the manuscripts is: 4 November 2007