International Journal of Manufacturing Technology and Management (IJMTM)

International Journal of Manufacturing Technology and Management

2006 Vol.9 No.1/2

Special Issue on Micro/Nano Machining Technology

Guest Editor: Associate Professor Zhou Libo


Pages Title and author(s)
1-17Micro-grinding electronic and optical materials using diamond-coated piezoelectric materials
Mark J. Jackson
DOI: 10.1504/IJMTM.2006.009982
18-33Vibration micro-machining of low-melting temperature glass
Nobuyuki Moronuki, Yasunori Saito, Arata Kaneko
DOI: 10.1504/IJMTM.2006.009983
34-50Etching characteristics of a silicon surface induced by focused ion beam irradiation
Noritaka Kawasegi, Noboru Morita, Shigeru Yamada, Noboru Takano, Tatsuo Oyama, Kiwamu Ashida, Jun Taniguchi, Iwao Miyamoto, Sadao Momota
DOI: 10.1504/IJMTM.2006.009984
51-63Nano-topography on axisymmetric aspherical ground surfaces
Nobuhito Yoshihara, Tsunemoto Kuriyagawa, Hiromichi Ono, Katsuo Syoji
DOI: 10.1504/IJMTM.2006.009985
64-78Development of a crack cutting method for glass plates used for flat panel displays
Kiyoshi Suzuki, Yoshiaki Shishido, Nobuhiro Koga, Takeki Shirai, Manabu Iwai, Tetsutaro Uematsu
DOI: 10.1504/IJMTM.2006.009986
79-93Improvement of grinding performance in ultra-precision grinding of lens mould by the help of megasonic coolant
Katsutoshi Tanaka, Masahiko Fukuta, Kiyoshi Suzuki, Manabu Iwai, Tetsutaro Uematsu, Syoji Mishiro
DOI: 10.1504/IJMTM.2006.009987
94-108Low-wear diamond electrode for micro-EDM of die-steel
Kiyoshi Suzuki, Manabu Iwai, Anurag Sharma, Sadao Sano, Tetsutaro Uematsu
DOI: 10.1504/IJMTM.2006.009988
109-119Electrorheological fluid-assisted polishing of WC micro aspherical glass moulding dies
Tsuyoshi Kaku, Tsunemoto Kuriyagawa, Nobuhito Yoshihara
DOI: 10.1504/IJMTM.2006.009989
120-129Molecular dynamics simulation of vibration-assisted cutting: influences of vibration parameters
Jun Shimizu, Libo Zhou, Hiroshi Eda
DOI: 10.1504/IJMTM.2006.009990
130-143Development of vision controlled bio-cell manipulation system
Libo Zhou, Zhongjun Qiu, Tomohiko Ishikawa, Tatsuo Kawakami, Hiroshi Eda
DOI: 10.1504/IJMTM.2006.009991
144-159Hybrid bulk micro-machining process suitable for roughness reduction in optical MEMS devices
Arvind Chandrasekaran, Muthukumaran Packirisamy, Ion Stiharu, Andre Delage
DOI: 10.1504/IJMTM.2006.009992
160-171Geometrical arrangement of ID grinding wheel in simultaneous-ID/OD combination centreless grinding
Yongbo Wu, Masana Kato
DOI: 10.1504/IJMTM.2006.009993
172-182High temperature MCP process suitable for extremely hard high functional SiC wafers
Nobuo Yasunaga, Yukiharu Yamamoto
DOI: 10.1504/IJMTM.2006.009994
183-200Effect of cutting edge truncation on ductile-regime grinding of hard and brittle materials
Xijun Kang, Jun'ichi Tamaki, Akihiko Kubo
DOI: 10.1504/IJMTM.2006.009995

 

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