International Journal of Computational Materials Science and Surface Engineering (IJCMSSE)

International Journal of Computational Materials Science and Surface Engineering

2009 Vol.2 No.3/4

Special Issue on Microelectromechanical Systems

Guest Editors: Prof. Jack Luo, Prof. William Milne and Prof. Mark Jackson

Editorial

Pages Title and author(s)
169-185The combination of a laser beam delivered by a water jet to perform deep etching in silicon for MEMS applications
David Wood, Paul Snowdon
DOI: 10.1504/IJCMSSE.2009.027481
186-207Recent developments in experimental on-chip stiction research: a review
W. Merlijn Van Spengen
DOI: 10.1504/IJCMSSE.2009.027482
208-226Thin film shape memory alloys and microactuators
Y.Q. Fu, J.K. Luo, A.J. Flewitt, W.M. Huang, S. Zhang, H.J. Du, W.I. Milne
DOI: 10.1504/IJCMSSE.2009.027483
227-242A review of silicon carbide development in MEMS applications
Liudi Jiang, Rebecca Cheung
DOI: 10.1504/IJCMSSE.2009.027484
243-267Advancement of micro/nanotechnology research in Institute of Precision Engineering of Xi'an Jiaotong University
Zhuang-De Jiang, Wei-Xuan Jing, Yu-Long Zhao, Hai-Rong Wang, De-Jiang Lu
DOI: 10.1504/IJCMSSE.2009.027485
268-281Low stress nanoporous SiNx membrane for cell culture
Jia-Shen Wei, Kwong Joo Leck, Philip Gaughwin, Marioara Avram, Ciprian Iliescu
DOI: 10.1504/IJCMSSE.2009.027486
282-301Design and fabrication of a microgripper with a topology optimal compliant mechanism
Shyh-Chour Huang, Chien-Ching Chiu, Wei-Liang Chen
DOI: 10.1504/IJCMSSE.2009.027487
302-311Modelling and simulations of DRIE including a footing effect
Jian Zhang, Qing-An Huang, Wei-Hua Li
DOI: 10.1504/IJCMSSE.2009.027488
312-334Process development support environment: a tool suite to engineer manufacturing sequences
Dirk Ortloff, Jens Popp, Thilo Schmidt, Rainer Bruck
DOI: 10.1504/IJCMSSE.2009.027489
335-341Indentation on very smooth silicon wafers
W.M. Huang, H. Fan, S.C. Leng
DOI: 10.1504/IJCMSSE.2009.027490
342-354Nanomechanical characterisation of MEMS thin film materials
J.H. He, J.K. Luo, M.A. Hopcroft, H.R. Le, D.F. Moore
DOI: 10.1504/IJCMSSE.2009.027491

 

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