Title: Study on the material removal mechanism of glass in single diamond grain grinding with ultrasonic vibration assisted

Authors: Jianyun Shen; Bin Dai; Xian Wu; Yuan Li; Zhongwei Hu

Addresses: College of Mechanical Engineering and Automation, Huaqiao University, Xiamen, Fujian, 361021, China ' College of Mechanical Engineering and Automation, Huaqiao University, Xiamen, Fujian, 361021, China ' College of Mechanical Engineering and Automation, Huaqiao University, Xiamen, Fujian, 361021, China ' College of Mechanical Engineering and Automation, Huaqiao University, Xiamen, Fujian, 361021, China ' College of Mechanical Engineering and Automation, Huaqiao University, Xiamen, Fujian, 361021, China

Abstract: The ultrasonic vibration assisted grinding is widely used in machining of hard and brittle material. This paper presents a study on the material removal mechanism in ultrasonic vibration assisted grinding of glass. The single diamond grain grinding experiments were performed with and without ultrasonic vibration assisted. The grinding force and acoustic emission signal were measured and analysed, and the ground groove morphology was observed and analysed in detail. The following conclusions can be obtained: 1) the material removal mechanism is changed from continuous crack propagation in conventional grinding to micro crack breakage in ultrasonic vibration assisted grinding; 2) the addition of ultrasonic vibration in grinding of brittle material can reduce the crack propagation distance; 3) compared with the conventional grinding, the energy distribution of acoustic emission signal in ultrasonic vibration assisted grinding is more concentrated.

Keywords: single diamond grain grinding; ultrasonic vibration assisted; material removal mechanism; acoustic emission signal.

DOI: 10.1504/IJAT.2019.097984

International Journal of Abrasive Technology, 2019 Vol.9 No.1, pp.60 - 72

Received: 04 May 2018
Accepted: 08 Nov 2018

Published online: 13 Feb 2019 *

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