Title: A discussion and prediction on thermal transfer of interface structure in micro/nano manufacturing

Authors: Bing Yang; Yuanbin Xiao; Xu Zhou; Wei Gao; Ping Yang

Addresses: Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, 212013 Zhenjiang, China ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, 212013 Zhenjiang, China ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, 212013 Zhenjiang, China ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, 212013 Zhenjiang, China ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, 212013 Zhenjiang, China

Abstract: Interface structure is a critical part of electronic components in computers, smart phones, automotive components and other electronic devices. Along with the development of technologies, the demand for electronic devices and their quality has increased rapidly in recent years. Thus, it is indispensable to study the thermal transfer of interface structure. In this article, we give a review of recent investigations on the thermal transfer of interface structure in micro/nano manufacturing. The research method is an important part of scientific research. Therefore, many research methods are listed in this paper. Some academic developments on design and reliability of interface structure by considering thermal characteristics under different loading conditions are also discussed.

Keywords: thermal transfer; interface structure; research method; micro/nano manufacturing.

DOI: 10.1504/IJMSI.2017.087351

International Journal of Materials and Structural Integrity, 2017 Vol.11 No.1/2/3, pp.16 - 31

Available online: 28 Sep 2017 *

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