Title: Numerical analysis of the dynamic characteristics for the POP structure based on finite element method

Authors: Jian Liu; Xiusheng Tang; Yu Liu; Ping Yang

Addresses: Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China

Abstract: In this study, considering the package-on-package (POP) structure for different locations on the PCB board, the dynamic characteristics of the POP package are analysed using finite element method. The results show that the POP structure for different locations on the PCB board greatly affects the natural frequency of the entire electronic device. It is a basic work for the future study such as experiment tests, layout optimisation and structural design for the POP structure.

Keywords: POP structure; finite element method; FEM; dynamic characteristics; natural frequency; numerical simulation; package-on-package structure; PCBs; printed circuit boards; layout optimisation; structural design.

DOI: 10.1504/IJMSI.2013.057921

International Journal of Materials and Structural Integrity, 2013 Vol.7 No.4, pp.241 - 250

Published online: 12 Jul 2014 *

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