Numerical analysis of the dynamic characteristics for the POP structure based on finite element method
by Jian Liu; Xiusheng Tang; Yu Liu; Ping Yang
International Journal of Materials and Structural Integrity (IJMSI), Vol. 7, No. 4, 2013

Abstract: In this study, considering the package-on-package (POP) structure for different locations on the PCB board, the dynamic characteristics of the POP package are analysed using finite element method. The results show that the POP structure for different locations on the PCB board greatly affects the natural frequency of the entire electronic device. It is a basic work for the future study such as experiment tests, layout optimisation and structural design for the POP structure.

Online publication date: Sat, 12-Jul-2014

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