Journal cover image

Browse issues


Vol. 31
Vol. 30
Vol. 29
Vol. 28
Vol. 27
Vol. 26
Vol. 25
Vol. 24
Vol. 23
Vol. 22
Vol. 21
Vol. 20
Vol. 19
Vol. 18
Vol. 17
Vol. 16
Vol. 15
Vol. 14
Vol. 13
Vol. 12
Vol. 11
Vol. 10
Vol. 9
Vol. 8
Vol. 7
Vol. 6
Vol. 5
Vol. 4
Vol. 3
Vol. 2
Vol. 1

International Journal of Manufacturing Technology and Management

2006 Vol. 9 No. 1/2

Special Issue on Micro/Nano Machining Technology

Guest Editor: Associate Professor Zhou Libo

 

PagesTitle and authors
1-17Micro-grinding electronic and optical materials using diamond-coated piezoelectric materials
Mark J. Jackson
DOI: 10.1504/IJMTM.2006.009982

18-33Vibration micro-machining of low-melting temperature glass
Nobuyuki Moronuki, Yasunori Saito, Arata Kaneko
DOI: 10.1504/IJMTM.2006.009983

34-50Etching characteristics of a silicon surface induced by focused ion beam irradiation
Noritaka Kawasegi, Noboru Morita, Shigeru Yamada, Noboru Takano, Tatsuo Oyama, Kiwamu Ashida, Jun Taniguchi, Iwao Miyamoto, Sadao Momota
DOI: 10.1504/IJMTM.2006.009984

51-63Nano-topography on axisymmetric aspherical ground surfaces
Nobuhito Yoshihara, Tsunemoto Kuriyagawa, Hiromichi Ono, Katsuo Syoji
DOI: 10.1504/IJMTM.2006.009985

64-78Development of a crack cutting method for glass plates used for flat panel displays
Kiyoshi Suzuki, Yoshiaki Shishido, Nobuhiro Koga, Takeki Shirai, Manabu Iwai, Tetsutaro Uematsu
DOI: 10.1504/IJMTM.2006.009986

79-93Improvement of grinding performance in ultra-precision grinding of lens mould by the help of megasonic coolant
Katsutoshi Tanaka, Masahiko Fukuta, Kiyoshi Suzuki, Manabu Iwai, Tetsutaro Uematsu, Syoji Mishiro
DOI: 10.1504/IJMTM.2006.009987

94-108Low-wear diamond electrode for micro-EDM of die-steel
Kiyoshi Suzuki, Manabu Iwai, Anurag Sharma, Sadao Sano, Tetsutaro Uematsu
DOI: 10.1504/IJMTM.2006.009988

109-119Electrorheological fluid-assisted polishing of WC micro aspherical glass moulding dies
Tsuyoshi Kaku, Tsunemoto Kuriyagawa, Nobuhito Yoshihara
DOI: 10.1504/IJMTM.2006.009989

120-129Molecular dynamics simulation of vibration-assisted cutting: influences of vibration parameters
Jun Shimizu, Libo Zhou, Hiroshi Eda
DOI: 10.1504/IJMTM.2006.009990

130-143Development of vision controlled bio-cell manipulation system
Libo Zhou, Zhongjun Qiu, Tomohiko Ishikawa, Tatsuo Kawakami, Hiroshi Eda
DOI: 10.1504/IJMTM.2006.009991

144-159Hybrid bulk micro-machining process suitable for roughness reduction in optical MEMS devices
Arvind Chandrasekaran, Muthukumaran Packirisamy, Ion Stiharu, Andre Delage
DOI: 10.1504/IJMTM.2006.009992

160-171Geometrical arrangement of ID grinding wheel in simultaneous-ID/OD combination centreless grinding
Yongbo Wu, Masana Kato
DOI: 10.1504/IJMTM.2006.009993

172-182High temperature MCP process suitable for extremely hard high functional SiC wafers
Nobuo Yasunaga, Yukiharu Yamamoto
DOI: 10.1504/IJMTM.2006.009994

183-200Effect of cutting edge truncation on ductile-regime grinding of hard and brittle materials
Xijun Kang, Jun'ichi Tamaki, Akihiko Kubo
DOI: 10.1504/IJMTM.2006.009995