Light-beam soldering of a lead free alloy
by L. Arturo Reyes, Dora I. Martinez, Victor Paramo, Maribel De La Garza, Rafael Colas
International Journal of Microstructure and Materials Properties (IJMMP), Vol. 5, No. 6, 2010

Abstract: Light-beam joints made from a Sn-Ag-Cu lead free solder alloy were studied. Joints were prepared with the five combinations of variables that resulted with the least amount of defects; these joints were tested in tension to evaluate their load bearing capacity. Solder pads made following these conditions were aged to study the growth of the intermetallic compound layer and its effect on the resistance of the joints. It was found that aging engrosses this layer and that the bearing capacity increased until the layer reaches 1.5 μm; further thickening reduces the resistance of the joints.

Online publication date: Wed, 19-Jan-2011

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