Title: Light-beam soldering of a lead free alloy

Authors: L. Arturo Reyes, Dora I. Martinez, Victor Paramo, Maribel De La Garza, Rafael Colas

Addresses: Facultad de Ingenieria Mecanica y Electrica, Universidad Autonoma de Nuevo Leon, Pedro de Alba s/n, 66450 San Nicolas de los Garza, N.L., Mexico. ' Facultad de Ingenieria Mecanica y Electrica, Universidad Autonoma de Nuevo Leon, Pedro de Alba s/n, 66450 San Nicolas de los Garza, N.L., Mexico. ' Facultad de Ingenieria Mecanica y Electrica, Universidad Autonoma de Nuevo Leon, Pedro de Alba s/n, 66450 San Nicolas de los Garza, N.L., Mexico. ' Facultad de Ingenieria Mecanica y Electrica, Universidad Autonoma de Nuevo Leon, Pedro de Alba s/n, 66450 San Nicolas de los Garza, N.L., Mexico. ' Facultad de Ingenieria Mecanica y Electrica, Universidad Autonoma de Nuevo Leon, Pedro de Alba s/n, 66450 San Nicolas de los Garza, N.L., Mexico

Abstract: Light-beam joints made from a Sn-Ag-Cu lead free solder alloy were studied. Joints were prepared with the five combinations of variables that resulted with the least amount of defects; these joints were tested in tension to evaluate their load bearing capacity. Solder pads made following these conditions were aged to study the growth of the intermetallic compound layer and its effect on the resistance of the joints. It was found that aging engrosses this layer and that the bearing capacity increased until the layer reaches 1.5 μm; further thickening reduces the resistance of the joints.

Keywords: light-beam joints; Sn-Ag-Cu alloys; intermetallic compound layers; lead free alloys; soldering alloys; load bearing capacity.

DOI: 10.1504/IJMMP.2010.038150

International Journal of Microstructure and Materials Properties, 2010 Vol.5 No.6, pp.491 - 500

Published online: 19 Jan 2011 *

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