Modelling and application of particle distribution for atmospheric plasma excitation Online publication date: Thu, 16-Feb-2017
by Jiangbo Chen; Bing Li; Jufan Zhang
International Journal of Nanomanufacturing (IJNM), Vol. 13, No. 1, 2017
Abstract: Atmospheric plasma polishing achieves removal of material by chemical reaction between gaseous active atoms and surface atom. The mechanism of etching - deposition competition exists on the gas-solid interface. Mechanism and control method of the deposition effect are analysed. Dominant elementary reactions list of mixtures of CF4/O2/He excitation is established. The conversion coefficients of reaction rate under atmospheric pressure are calculated, and the variation trends in concentrations of dominant particles components in the plasma jet are analysed by simulating. Then, the production trends of residual sedimentary particles under situation of different flow ratio are obtained. The results of theoretical simulations are used to predict the reasonable range of values of critical process parameters. Experimental verification is completed.
Online publication date: Thu, 16-Feb-2017
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Nanomanufacturing (IJNM):
Login with your Inderscience username and password:
Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.
If you still need assistance, please email firstname.lastname@example.org