Modelling and application of particle distribution for atmospheric plasma excitation
by Jiangbo Chen; Bing Li; Jufan Zhang
International Journal of Nanomanufacturing (IJNM), Vol. 13, No. 1, 2017

Abstract: Atmospheric plasma polishing achieves removal of material by chemical reaction between gaseous active atoms and surface atom. The mechanism of etching - deposition competition exists on the gas-solid interface. Mechanism and control method of the deposition effect are analysed. Dominant elementary reactions list of mixtures of CF₄/O₂/H_e excitation is established. The conversion coefficients of reaction rate under atmospheric pressure are calculated, and the variation trends in concentrations of dominant particles components in the plasma jet are analysed by simulating. Then, the production trends of residual sedimentary particles under situation of different flow ratio are obtained. The results of theoretical simulations are used to predict the reasonable range of values of critical process parameters. Experimental verification is completed.

Online publication date: Thu, 23-Feb-2017

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