Title: Residual stress analysis in micro- and nano-structured materials by X-ray diffraction

Authors: P. Gergaud, P. Goudeau, O. Sicardy, N. Tamura, O. Thomas

Addresses: TECSEN-CNRS, Universite Paul Cezanne, 13397 Marseille Cedex 20, France. ' Laboratoire de Metallurgie Physique, UMR 6630 CNRS, Universite de Poitiers, BP 30179, 86962 Futuroscope Chasseneuil, France. ' Commissariat a l'Energie Atomique, DRT-LITEN - Departement des Technologies pour l'Energie et les Nanomateriaux, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France. ' Lawrence Berkeley National Laboratory, 1 Cyclotron Road, Berkeley CA 94720, USA. ' TECSEN-CNRS, Universite Paul Cezanne, 13397 Marseille Cedex 20, France

Abstract: Micro- and nano-structured materials often exhibit high level of residual stresses which may affect the reliability of electronic devices. Stress control is, therefore, essential for improving device lifetime. X-ray diffraction is one of the most widely used techniques for stress analysis. It is essentially non destructive and allows for the study of both the microstructural and elastic properties of all the diffracting phases in complex materials. With the advent of third generation synchrotrons and the development of new X-ray optics and detectors as well as enhanced data analysis capabilities, measurements of specific stress features such as local stresses, stress gradients and stress heterogeneities are now within reach. This paper reviews the state of the art in that field illustrated with a few examples.

Keywords: microstructures; nanostructures; material properties; nanotechnology; residual stresses; synchrotron radiation; X-ray diffraction; reliability; stress control; measurements.

DOI: 10.1504/IJMPT.2006.009475

International Journal of Materials and Product Technology, 2006 Vol.26 No.3/4, pp.354 - 371

Published online: 04 Apr 2006 *

Full-text access for editors Full-text access for subscribers Purchase this article Comment on this article