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Title: A review on design of interface structure in micro/nano manufacturing

Authors: Ping Yang; Yunqing Tang; Bing Yang

Addresses: Laboratory of Advanced Design, Manufacturing & Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, 212013 Zhenjiang, China ' Laboratory of Advanced Design, Manufacturing & Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, 212013 Zhenjiang, China ' Laboratory of Advanced Design, Manufacturing & Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, 212013 Zhenjiang, China

Abstract: Interface structure is a critical part of electronic components in computers, smart phones, automotive components and other electronic devices. Along with the development of technologies, the demand for electronic devices and their quality has increased rapidly in recent years. Thus, it is indispensable to research the design and reliability of interface structure. In this article, we give a review of recent investigations on the design and reliability of interface structure. Some academic developments on design and reliability of interface structure by considering thermal characteristics under different loading conditions are discussed.

Keywords: interface structure; reliability; thermal loading; micromanufacturing; interfaces; nanomanufacturing; nanotechnology; electronic components; service life; thermal conductivity; nanofilms.

DOI: 10.1504/IJMSI.2016.079638

International Journal of Materials and Structural Integrity, 2016 Vol.10 No.1/2/3, pp.23 - 33

Available online: 05 Oct 2016 *

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