A review on design of interface structure in micro/nano manufacturing
by Ping Yang; Yunqing Tang; Bing Yang
International Journal of Materials and Structural Integrity (IJMSI), Vol. 10, No. 1/2/3, 2016

Abstract: Interface structure is a critical part of electronic components in computers, smart phones, automotive components and other electronic devices. Along with the development of technologies, the demand for electronic devices and their quality has increased rapidly in recent years. Thus, it is indispensable to research the design and reliability of interface structure. In this article, we give a review of recent investigations on the design and reliability of interface structure. Some academic developments on design and reliability of interface structure by considering thermal characteristics under different loading conditions are discussed.

Online publication date: Thu, 06-Oct-2016

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