Title: Modelling and analysis of pad surface topography and slurry particle size distribution effects on material removal rate in chemical mechanical planarisation

Authors: Changxue Wang, Peter Sherman, Abhijit Chandra

Addresses: Department of AEEM and Department of Statistics, Iowa State University, Ames IA 50010, USA. ' Department of AEEM and Department of Statistics, Iowa State University, Ames IA 50010, USA. ' Department of Mechanical Engineering, Iowa State University, Ames IA 50010, USA

Abstract: Traditionally, static or steady state models of material removal rate (MRR) in a chemical mechanical planarisation (CMP) process have been developed, and the effects of properties of consumables such as pad or slurry particles on MRR have been investigated. There also exist dynamic or transient models of the CMP process; however, the effect of slurry particle size and distribution is typically neglected in these dynamic models. The present work combines these different approaches by attempting to develop a dynamic model of the CMP process capable of representing MRR decay, which can also account for the effects due to slurry particle size and distribution.

Keywords: chemical mechanical planarisation; CMP; material removal rate; MRR; pad surface roughness; slurry particle size distribution; static models; dynamic models; topography evolution; PDF; contact mechanics; stochastic process; silicon wafers; semiconductor manufacturing.

DOI: 10.1504/IJMTM.2005.007700

International Journal of Manufacturing Technology and Management, 2005 Vol.7 No.5/6, pp.504 - 529

Published online: 02 Sep 2005 *

Full-text access for editors Access for subscribers Purchase this article Comment on this article