Title: Low-voltage silicon chip/glass ring anodic bonding for MEMS device packaging and experimental evaluation of bonding quality

Authors: Quan Wang; Ran Hu; Xiaodan Yang; Jianning Ding

Addresses: Mechanical Engineering School, Jiangsu University, 301 Xuefu Road, Zhenjiang City, 212013, Jiangsu Province, China; State Key Laboratory of Transducer Technology, Chinese Academy of Sciences, 865 Changning Road, Shanghai City, 200050, China. ' Mechanical Engineering School, Jiangsu University, 301 Xuefu Road, Zhenjiang City, 212013, Jiangsu Province, China. ' Mechanical Engineering School, Jiangsu University, 301 Xuefu Road, Zhenjiang City, 212013, Jiangsu Province, China. ' Centre of Micro/Nano Science and Technology, Jiangsu University, 301 Xuefu Road, Zhenjiang City, 212013, Jiangsu Province, China

Abstract: Packaging technologies are a great issue in MEMS/NEMS device fabrication. Silicon to glass anodic bonding is a common bonding technique for packaging. In this paper, we describe low voltage silicon chip/glass ring anodic bonding to meet the need of MEMS device batch fabrication. The bonding voltage decreases to be 160 V and the bonding time is cut down from 30 minutes to be about two minutes. The anodic bonding quality of silicon chip/glass ring, effects of thermal cycling and thermal shock, are evaluated in details. The bonding strength is measured using a tensile tester and the fracture mainly occurs inside the silicon chip rather than along the interface. The bonding surface has large adherence intension and can work under harsh environment.

Keywords: packaging; silicon chips; Pyrex7740; anodic bonding; bonding quality; glass bonding; silicon bonding; MEMS device; microelectromechanical devices; batch fabrication; thermal cycling; thermal shock; bond strength; tensile testing; fracture.

DOI: 10.1504/IJMPT.2011.044884

International Journal of Materials and Product Technology, 2011 Vol.42 No.1/2, pp.121 - 129

Received: 18 Dec 2010
Accepted: 28 Apr 2011

Published online: 07 Mar 2015 *

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