Low-voltage silicon chip/glass ring anodic bonding for MEMS device packaging and experimental evaluation of bonding quality
by Quan Wang; Ran Hu; Xiaodan Yang; Jianning Ding
International Journal of Materials and Product Technology (IJMPT), Vol. 42, No. 1/2, 2011

Abstract: Packaging technologies are a great issue in MEMS/NEMS device fabrication. Silicon to glass anodic bonding is a common bonding technique for packaging. In this paper, we describe low voltage silicon chip/glass ring anodic bonding to meet the need of MEMS device batch fabrication. The bonding voltage decreases to be 160 V and the bonding time is cut down from 30 minutes to be about two minutes. The anodic bonding quality of silicon chip/glass ring, effects of thermal cycling and thermal shock, are evaluated in details. The bonding strength is measured using a tensile tester and the fracture mainly occurs inside the silicon chip rather than along the interface. The bonding surface has large adherence intension and can work under harsh environment.

Online publication date: Sat, 07-Mar-2015

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