Title: Crystallographic edge removal of silicon dioxide micro-parts in bulk micromachining

Authors: Dugan Um; Bahram Asiabanpour; Dave Foor; Mathew Kurtz; Mary Tellers; M. Todd McGregor

Addresses: Texas A&M University – Corpus Christi, Corpus Christi, TX, USA ' Texas State University – San Marcos, San Marcos, TX, USA ' Austin Community College, Austin, TX, USA ' Worcester Polytechnic Institute, Worcester, MA, USA ' University of Maryland, College Park, MD, USA ' Austin Community College, Austin, TX, USA

Abstract: The purpose of this research was to find a cost-effective and repeatable method for releasing high-quality micro-parts from a silicon substrate by bulk micromachining technology. Crystallographic shape removal technology on the finally released silicon oxide parts was put into scrutiny. Several methods were approached as possible solutions. These methods include ethylenediamine pyrocatechol water etchant, the addition of a boron dopant to the silicon dioxide layer, pre-thinning of wafers and the use of polyimide coatings to thin the silicon substrate subsequent to part release. The combined method of boron doping and polyimide coating produced the best results.

Keywords: MEMS; microelectromechanical systems; bulk micromachining; microgears; SiO2; silicon dioxide; crystallographic shape removal; boron doping; polyimide coatings.

DOI: 10.1504/IJRAPIDM.2011.044704

International Journal of Rapid Manufacturing, 2011 Vol.2 No.4, pp.299 - 315

Published online: 18 Feb 2015 *

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