Crystallographic edge removal of silicon dioxide micro-parts in bulk micromachining
by Dugan Um; Bahram Asiabanpour; Dave Foor; Mathew Kurtz; Mary Tellers; M. Todd McGregor
International Journal of Rapid Manufacturing (IJRAPIDM), Vol. 2, No. 4, 2011

Abstract: The purpose of this research was to find a cost-effective and repeatable method for releasing high-quality micro-parts from a silicon substrate by bulk micromachining technology. Crystallographic shape removal technology on the finally released silicon oxide parts was put into scrutiny. Several methods were approached as possible solutions. These methods include ethylenediamine pyrocatechol water etchant, the addition of a boron dopant to the silicon dioxide layer, pre-thinning of wafers and the use of polyimide coatings to thin the silicon substrate subsequent to part release. The combined method of boron doping and polyimide coating produced the best results.

Online publication date: Wed, 18-Feb-2015

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Rapid Manufacturing (IJRAPIDM):
Login with your Inderscience username and password:

Username:        Password:          Forgotten your password?

Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com