Authors: Pengqiang Fu; Feihu Zhang; Chenhui An; Qiang Zhang
Addresses: School of Mechatronics Engineering, Harbin Institute of Technology, 150001, Harbin, China. ' School of Mechatronics Engineering, Harbin Institute of Technology, 150001, Harbin, China. ' Research Center of Laser Fusion, Chinese Academy of Engineering Physics, 621900, Mianyang, China. ' School of Mechatronics Engineering, Harbin Institute of Technology, 150001, Harbin, China
Abstract: To achieve ductile processing of brittle materials is a key factor to obtain high quality finished surface. A new strategy was carried to clarify the brittle-to-ductile transition mechanism. The KDP crystal was processed by a mono diamond tool with arc-nose, and the plastic deformation can be found in the inside chip by optical microscope, also apparent transitional zone of brittle fracture to plastic deformation along the width direction of chips. It can be inferred that the width of plastically deforming area is sensitive to the cutting parameter feedrate. The critical cutting thickness was calculated by the parameters measured from the chips. At last a new model for calculating the critical cutting thickness of KDP crystal was given.
Keywords: KDP crystals; brittle-to-ductile transition; critical cutting thickness; chip morphology; single point diamond fly cutting; SPDFC; brittle materials; cutting mechanism; chip deformation; nanomanufacturing; nanotechnology; ductile processing; surface roughness; surface quality; potassium dihydrogen phosphate; modelling.
International Journal of Nanomanufacturing, 2011 Vol.7 No.3/4, pp.214 - 222
Available online: 14 Sep 2011Full-text access for editors Access for subscribers Purchase this article Comment on this article