Title: Study on the heat transfer characteristics of Al2O3/ZnO film interface by using molecular dynamics simulations
Authors: Haifeng Xu, Yongsheng Wu, Xianxin Xu, Pei Li, Xiaoliang Wang, Huan Wang, Liqiang Zhang, Ping Yang
Addresses: Laboratory of Materials and Micro-Structural Integrity, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' Laboratory of Materials and Micro-Structural Integrity, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' Laboratory of Materials and Micro-Structural Integrity, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' Laboratory of Materials and Micro-Structural Integrity, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' Laboratory of Materials and Micro-Structural Integrity, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' Laboratory of Materials and Micro-Structural Integrity, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China
Abstract: The heat transfer characteristics of Al2O3/ZnO film interface were investigated by using the equilibrium molecular dynamics (EMD) method. The thermal conductivities of Al2O3/ZnO film interface at different temperatures and film interface thicknesses were calculated. The results indicated that the thermal conductivity of Al2O3/ZnO film interface was obviously influenced by the temperature and film interface thickness. With the film interface thicknesses from 3.3 nm to 5.7 nm, the thermal conductivity increased with the increasing of film interface thickness. With the temperatures from 300 K to 600 K, the thermal conductivity decreased with the increasing of temperature.
Keywords: molecular dynamics; simulation; Al2O3 ZnO film interface; potential function; thermal conductivity; phonon scattering; aluminium oxide; zinc oxide; heat transfer; temperatures; film interface thickness.
DOI: 10.1504/IJMSI.2011.041936
International Journal of Materials and Structural Integrity, 2011 Vol.5 No.2/3, pp.241 - 251
Published online: 27 Nov 2014 *
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