Study on the heat transfer characteristics of Al₂O₃/ZnO film interface by using molecular dynamics simulations
by Haifeng Xu, Yongsheng Wu, Xianxin Xu, Pei Li, Xiaoliang Wang, Huan Wang, Liqiang Zhang, Ping Yang
International Journal of Materials and Structural Integrity (IJMSI), Vol. 5, No. 2/3, 2011

Abstract: The heat transfer characteristics of Al₂O₃/ZnO film interface were investigated by using the equilibrium molecular dynamics (EMD) method. The thermal conductivities of Al₂O₃/ZnO film interface at different temperatures and film interface thicknesses were calculated. The results indicated that the thermal conductivity of Al₂O₃/ZnO film interface was obviously influenced by the temperature and film interface thickness. With the film interface thicknesses from 3.3 nm to 5.7 nm, the thermal conductivity increased with the increasing of film interface thickness. With the temperatures from 300 K to 600 K, the thermal conductivity decreased with the increasing of temperature.

Online publication date: Thu, 27-Nov-2014

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