Title: The effectiveness study of Double Sampling s charts application on destructive testing process

Authors: Pei-Hsi Lee, Chau-Chen Torng, Jhih-Cyuan Wu, Chun-Chieh Tseng

Addresses: Department of Business Administration, Chung Yuan Christian University, 200, Chung Pei Rd., Chung Li 32023, Taiwan. ' Institute School of Industrial Engineering and Management, National Yunlin University of Science and Technology, 123 University Road, Section 3, Douliou, Yunlin 64002, Taiwan. ' Institute School of Industrial Engineering and Management, National Yunlin University of Science and Technology, 123 University Road, Section 3, Douliou, Yunlin 64002, Taiwan. ' Institute School of Industrial Engineering and Management, National Yunlin University of Science and Technology, 123 University Road, Section 3, Douliou, Yunlin 64002, Taiwan

Abstract: In semiconductor processes, many data of process were obtained by the destructive testing methods, which will incur high inspection cost. Double Sampling (DS) s charts can quickly detect the shifts of process standard deviation and effectively reduce sample size. In this study, DS s charts were designed based on a statistical viewpoint, and their performance was evaluated in comparison with Shewhart s charts. A real case of wire bonding process of IC packaging was used to demonstrate the effectiveness of proposed DS s charts in reducing the sample size of destructive testing.

Keywords: double sampling s charts; statistical process control; SPC; destructive testing; IC packaging; wire bonding; semiconductor manufacturing; control charts.

DOI: 10.1504/IJPD.2010.036394

International Journal of Product Development, 2010 Vol.12 No.3/4, pp.324 - 335

Published online: 02 Nov 2010 *

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