Title: Phase diagram investigation and characterisation of ternary Sn–In–Me (Me = Ag, Cu) lead-free solder systems

Authors: Aleksandra Milosavljevic, Dragana Zivkovic, Dragan Manasijevic, Nadezda Talijan, Vladan Cosovic, Aleksandar Grujic, B. Marjanovic

Addresses: Metallurgy Department, Mining and Metallurgy Institute, Zeleni bulevar 35, 19210 Bor, Serbia. ' Technical Faculty, Metallurgy and Materials Engineering Department, University of Belgrade, Vojske Jugoslavije 12, 19210 Bor, Serbia. ' Technical Faculty, Metallurgy and Materials Engineering Department, University of Belgrade, Vojske Jugoslavije 12, 19210 Bor, Serbia. ' Materials and Metallurgy Department, University of Belgrade, Institute of Chemistry, Technology and Metallurgy, Njegoseva 12, 11000 Belgrade, Serbia. ' Materials and Metallurgy Department, University of Belgrade, Institute of Chemistry, Technology and Metallurgy, Njegoseva 12, 11000 Belgrade, Serbia. ' Materials and Metallurgy Department, University of Belgrade, Institute of Chemistry, Technology and Metallurgy, Njegoseva 12, 11000 Belgrade, Serbia. ' Technical Faculty, Metallurgy and Metal Processing Department, University of Belgrade, Vojske Jugoslavije 12, 19210 Bor, Serbia

Abstract: The Sn–In–Me (Me = Ag, Cu) systems belong to the group of potential candidates for lead-free solder materials. Samples, representing two vertical sections: with In : Ag = 7 : 3 from Sn–In–Ag ternary system and with Cu : In = 1 : 9 from Sn–In–Cu ternary system, were measured with Differential Scanning Calorimetry (DSC). The experimental transformation temperatures were compared with CALPHAD-type calculation results based on thermodynamic parameter values from COST531 database. The characterisation of investigated samples was done using Scanning Electron Microscopy with Energy Dispersive X-ray (SEM–EDX), Light Optical Microscopy (LOM), electroconductivity and microhardness measurements.

Keywords: lead-free solders; phase diagrams; electroconductivity; Sn–In–Ag; Sn–In–Cu; Pb-free solders; microhardness; indium; copper; silver; tin.

DOI: 10.1504/IJMPT.2010.034263

International Journal of Materials and Product Technology, 2010 Vol.39 No.1/2, pp.95 - 107

Published online: 31 Jul 2010 *

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