Phase diagram investigation and characterisation of ternary Sn–In–Me (Me = Ag, Cu) lead-free solder systems
by Aleksandra Milosavljevic, Dragana Zivkovic, Dragan Manasijevic, Nadezda Talijan, Vladan Cosovic, Aleksandar Grujic, B. Marjanovic
International Journal of Materials and Product Technology (IJMPT), Vol. 39, No. 1/2, 2010

Abstract: The Sn–In–Me (Me = Ag, Cu) systems belong to the group of potential candidates for lead-free solder materials. Samples, representing two vertical sections: with In : Ag = 7 : 3 from Sn–In–Ag ternary system and with Cu : In = 1 : 9 from Sn–In–Cu ternary system, were measured with Differential Scanning Calorimetry (DSC). The experimental transformation temperatures were compared with CALPHAD-type calculation results based on thermodynamic parameter values from COST531 database. The characterisation of investigated samples was done using Scanning Electron Microscopy with Energy Dispersive X-ray (SEM–EDX), Light Optical Microscopy (LOM), electroconductivity and microhardness measurements.

Online publication date: Sat, 31-Jul-2010

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