Title: Failure site transition in Pb-free solder joints caused by manufacturing variabilities in BGA and MLF components in low cycle fatigue analysis

Authors: Leila J. Ladani

Addresses: Mechanical and Aerospace Engineering Department, Utah State University, 84341, Logan, UT, USA

Abstract: A comprehensive three level design of experiment that is applied on the manufacturing process to compare the effect of variability in printing and reflow processes on quality and durability of Micro Lead Frame (MLF) and Ball Grid Array (BGA) components. The quality and durability of the BGA and MLF components were studied very closely by thermo-mechanical experiment and finite element simulation. Different populations of failures indicating different failure site and mechanisms were observed in both BGA and MLF components. Conflictions were observed when parameter variations caused durability improvement in one type and durability degradation in the other package.

Keywords: BGA; ball grid arrays; lead-free solder joints; failure analysis; design of experiments; DOE; manufacturing variabilities; fatigue analysis; micro lead frame; MLF; reflow; durability; thermo-mechanical experiments; finite element method; FEM; simulation; PCB assembly; printed wiring assembly; PWA.

DOI: 10.1504/IJMPT.2010.031431

International Journal of Materials and Product Technology, 2010 Vol.37 No.3/4, pp.312 - 327

Published online: 03 Feb 2010 *

Full-text access for editors Full-text access for subscribers Purchase this article Comment on this article