Failure site transition in Pb-free solder joints caused by manufacturing variabilities in BGA and MLF components in low cycle fatigue analysis
by Leila J. Ladani
International Journal of Materials and Product Technology (IJMPT), Vol. 37, No. 3/4, 2010

Abstract: A comprehensive three level design of experiment that is applied on the manufacturing process to compare the effect of variability in printing and reflow processes on quality and durability of Micro Lead Frame (MLF) and Ball Grid Array (BGA) components. The quality and durability of the BGA and MLF components were studied very closely by thermo-mechanical experiment and finite element simulation. Different populations of failures indicating different failure site and mechanisms were observed in both BGA and MLF components. Conflictions were observed when parameter variations caused durability improvement in one type and durability degradation in the other package.

Online publication date: Wed, 03-Feb-2010

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