Authors: Yu-Lin Shen
Addresses: Department of Mechanical Engineering, MSC 01 1150, University of New Mexico, Albuquerque, NM 87131, USA
Abstract: Numerical analyses of deformation in thin metal films are presented, with a focus on the effect of physical constraint imposed by the underlying substrate material. Continuum-based finite element modelling is used, for the purpose of establishing an overall mechanistic view without recourse to microstructural details. The model systems consist of aluminium in the thin-film form, with possible silicon, polyimide or silicon dioxide directly bonded to the metal. Particular attention is devoted to correlating the overall material response with the evolution of local stress and deformation fields. We highlight certain unique features to help facilitate a better understanding of the deformation characteristics and clarify some common misconceptions.
Keywords: thin films; metal films; mechanical properties; plastic deformation; finite element method; FEM; modelling; MEMS; microelectromechanical systems; substrate material; microstructure; aluminium; stress.
International Journal of Theoretical and Applied Multiscale Mechanics, 2009 Vol.1 No.1, pp.57 - 70
Published online: 08 Jan 2009 *Full-text access for editors Access for subscribers Purchase this article Comment on this article