Title: Development of cryogenic power modules for superconducting hybrid power electronic system

Authors: Hua Ye, Changwoo Lee, Randy W. Simon, Pradeep Haldar

Addresses: College of Nanoscale Science and Engineering, State University of New York at Albany, Albany, NY 12203, USA. ' College of Nanoscale Science and Engineering, State University of New York at Albany, Albany, NY 12203, USA. ' College of Nanoscale Science and Engineering, State University of New York at Albany, Albany, NY 12203, USA. ' College of Nanoscale Science and Engineering, State University of New York at Albany, Albany, NY 12203, USA

Abstract: This paper presents the developments of high-performance integrated cryogenic power modules, where both driver components and power Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) are integrated in a single package, to be used in cryogenic inverter operating at liquid nitrogen temperature. Compact high-voltage, cryogenic integrated power modules with single power MOSFET that exhibited more than 14x improvement in on-resistance and continuous current-carrying capability exceeding 40 A. A multipower MOSFETs integrated cryogenic power module is also developed in order to further increase the power density and reduce the size and weight of the cryogenic power system. Two different approaches taken in the developments of these modules are reported in this paper.

Keywords: cryogenic power electronics; electronic packaging; high temperature superconductors; finite element method; FEM; driver components; MOSFETs; liquid nitrogen; power density.

DOI: 10.1504/IJMPT.2009.022412

International Journal of Materials and Product Technology, 2009 Vol.34 No.1/2, pp.188 - 199

Published online: 04 Jan 2009 *

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