Title: Lapping, polishing and Ultrasonic Machining of quartz mono crystals

Authors: Jose Daniel Biasoli De Mello, Pedro Luiz Guzzo

Addresses: Laboratorio de Tribologia e Materiais, Faculdade de Engenharia Mecanica, Universidade Federal de Uberlandia, Bloco 1R, Campus Santa Monica, 38400-902 Uberlandia MG, Brazil. ' Departamento de Engenharia de Minas, Centro de Tecnologia e Geociencias, Universidade Federal de Pernambuco, 50740-530 Recife PE, Brazil

Abstract: Lapping, Polishing and Ultrasonic Machining of quartz mono crystals are investigated in relation to operating conditions such as abrasive particle size, normal stress and crystallographic orientation. Brittle microcracking was the dominant material removal mechanism but secondary mechanisms were also observed. The Grit Size effect observed in material removal rates was explained in terms of the crack density limit. The effect of crystallographic orientation on material removal rates and surface roughness was discussed in relation to fracture toughness and static hardness.

Keywords: quartz crystal; abrasive machining; grit size; anisotropy; brittle microcracking; ultrasonic machining; lapping; polishing; abrasive particle size; stress; crystallographic orientation; material removal rate; MRR; crack density limit; surface roughness; fracture toughness; static hardness.

DOI: 10.1504/IJSURFSE.2008.022285

International Journal of Surface Science and Engineering, 2008 Vol.2 No.6, pp.457 - 479

Published online: 26 Dec 2008 *

Full-text access for editors Access for subscribers Purchase this article Comment on this article