Title: Thermodynamic framework for coupling of elasto-viscoplasticity and nonlocal anisotropic damage for microelectronics solder alloys
Authors: Rashid K. Abu Al-Rub
Addresses: Zachry Department of Civil Engineering Texas A&M University College Station, TX 77843, USA
Abstract: The microstructure of soldered materials is known to have a strong influence on damage initiation and propagation and being localised. Moreover, it is well-established in the literature that the final failure of a solder joint is preceded by inhomogeneities in the deformation of the joint at relatively early stages, and that predicting the non-uniform micro-damage distribution during thermo-mechanical loading allows one to ultimately predict the failure location and time and then in turn improve the performance and reliability of microelectronic solder alloys. This study develops a general consistent and systematic framework for the analysis of microelectronic solder alloys that assesses a strong coupling between rate-dependent plasticity and rate-dependent damage within the framework of thermodynamic laws and nonlocal gradient-dependent theory. The model presented in this paper can be considered as a feasible thermodynamic approach for microelectronic solder alloys that enables one to derive various coupled thermo-viscoplasticity-viscodamage theories by introducing simplifying assumptions.
Keywords: nonlocal damage; anisotropic damage; viscoplasticity; heterogeneous media; length scale; elastoplasticity; microelectronics; solder alloys; microstructure; solder joints; plasticity; solder joint failure; thermodynamics.
International Journal of Materials and Structural Integrity, 2008 Vol.2 No.1/2, pp.106 - 137
Available online: 21 Jun 2008 *Full-text access for editors Access for subscribers Purchase this article Comment on this article